Surface Mount Chip LEDs
Package Dimensions
Description
The MSL-174B, a BLUE source Chip LED device,
is designed in an indnstry standard package suitable
for SMT assembly method. It utilizes InGaN on SiC
LED chip technology and water clear epoxy package.
1.25
( 0.049 )
MSL-174B
CATHODE MARK
POLARITY
2.0
( 0.079)
1.40
(0.055)
0.80
(0.031)
1.25
(0.049)
Applications
l
l
l
l
0.30
( 0.012 )
Small Size
Industry Standard Footprint(0805)
Compatible with IR Solder process
Availalble in 8 mm Tape on 7"(178mm)
Diameteer Reels
R0.2
(0.008)
PCB
0.40
(0.016)
SOLDERING
TERMINAL
Recommended Solder Patterns
Features
l
l
l
l
Push-Button Backlighting
LCD Backlighting
Symbol Backlighting
Front Panel Indicator
1.20
(0.047)
0.90
(0.035)
1.20
(0.047)
Absolute Maximum Ratings
NOTE:
1. All dimensions are in millimeter (inches)
2. Tolerance is ± 0.1mm (.004") unless otherwise specified.
@ T
A
=25
o
C
Parameter
Peak Forward Current(1/10 Duty Cycle@1KHz )
DC Forward Current
Power Dissipation
Reverse Voltage
Operating Temperature Range
Storage Temperature Range
Electrostatic Discharge Threshold
Symbol
I
FP
I
F
P
D
V
R
T
OPR
T
STG
E
OT
Maximum Rating
100
30
126
5
-20
o
C
to +80
o
C
Unit
mA
mA
mW
V
-30
o
C
to +100
o
C
1000
V
Unity Opto Technology Co., Ltd.
1.20
(.047)
11/23/2000
UOT [ UNITY OPTO TECHNOLOGY ]
