Surface Mount Chip LEDs
Description
The MSL-174HG, a GREEN source Chip
LED device, is designed in an indnstry standard
package suitable for SMT assembly method. It
utilizes GaP on GaP LED chip technology
and water clear epoxy package.
2.0
( 0.079)
1.40
(0.055)
0.80
(0.031)
1.25
( 0.049 )
MSL-174HG
Package Dimensions
CATHODE MARK
POLARITY
1.25
(0.049)
Applications
l
l
l
l
0.30
( 0.012 )
Small Size
Industry Standard Footprint(0805)
Compatible with IR Solder process
Availalble in 8 mm Tape on 7"(178mm)
Diameteer Reels
R0.2
(0.008)
PCB
0.40
(0.016)
SOLDERING
TERMINAL
Recommended Solder Patterns
Features
l
l
l
l
Push-Button Backlighting
LCD Backlighting
Symbol Backlighting
Front Panel Indicator
1.20
(0.047)
0.90
(0.035)
1.20
(0.047)
Absolute Maximum Ratings
NOTE:
1. All dimensions are in millimeter (inches)
2. Tolerance is ± 0.1mm (.004") unless otherwise specified.
@ T
A
=25
o
C
Parameter
Peak Forward Current(1/10 Duty Cycle@1KHz )
DC Forward Current
Power Dissipation
Reverse Voltage
Operating Temperature Range
Storage Temperature Range
Symbol
I
FP
I
F
P
D
V
R
T
OPR
T
STG
Maximum Rating
120
25
75
5
-20
o
C
to +80
o
C
Unit
mA
mA
mW
V
-30
o
C
to +100
o
C
Unity Opto Technology Co., Ltd.
1.20
(.047)
11/24/2000
UOT [ UNITY OPTO TECHNOLOGY ]
