Surface Mount Chip LEDs
Description
The MSL-1947HB3, a BLUE source Chip LED device,
is designed in an indnstry standard package suitable
for SMT assembly method. It utilizes GaN on Sapphire
LED chip technology and water clear epoxy package.
MSL-1947HB3-S
Package Dimensions
Applications
l
l
l
l
Small Size (Extra Thin)
Industry Standard Footprint(0603)
Compatible with IR Solder process
Availalble in 8 mm Tape on 7"(178mm)
Diameteer Reels
Features
l
l
l
l
Recommended Solder Patterns
Push-Button Backlighting
LCD Backlighting
Symbol Backlighting
Front Panel Indicator
NOTE:
1. All dimensions are in millimeter (inches)
2. Tolerance is ± 0.15mm (.006") unless otherwise specified.
Absolute Maximum Ratings
@ T
A
=25
o
C
Parameter
Peak Forward Current(1/10 Duty Cycle@1KHz )
DC Forward Current
Power Dissipation
Reverse Voltage
Electrostatic Discharge Threshold (HBM)
Note A
Operating Temperature Range
Storage Temperature Range
Note A : HBM(Human Body Model)
Symbol
I
FP
I
F
P
D
V
R
E
OT
T
OPR
T
STG
Maximum Rating
100
30
125
5
300
-25
o
C
to +80
o
C
-30
o
C
to +100
o
C
Unit
mA
mA
mW
V
V
Unity Opto Technology Co., Ltd.
10/16/2003
UOT [ UNITY OPTO TECHNOLOGY ]
