SIDE LOOK PACKAGE
SOLID STATE LAMP
Description
The MSL-824HG1 is designed based on in an industry
standard package for ease of handing and use.
The package is water clear epoxy within white plastic.
MSL-824HG1
Package Dimensions
Units : mm
Applications
l
l
l
LCD backlighting
Symbol backlighting
Front panel indicator
A
C
Features
l
l
l
High performance
Excellent chip to chip consistency
High reliability
Notes :
1. All dimensions are in millimeters.
2. Tolerance is ± 0.1 mm unless otherwise noted.
3. Lead plating is minimum 80 mirco inch of silver.
Absolute Maximum Ratings
@ T
A
=25
o
C
Parameter
Power Dissipation
Peak Forward Current (1/100 Duty Cycle 1Khz pulse)
Continuous Forward Current
Reverse Current (V
R
=5V)
Operating Temperature Range
Symbol
P
ad
I
pf
I
af
I
R
T
opr
Maximum Rating
100
120
30
100
-40 C to +85 C
-40
o
C to +85
o
C
o
o
Unit
mW
mA
mA
µA
Storage Temperature Range
T
stg
o
Lead Soldering Temperature 260 C for 5 second (2.0mm From Body)
Unity Opto Technology Co., Ltd.
11/06/2000
UOT [ UNITY OPTO TECHNOLOGY ]
