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CRCW120625R0DETAP 参数 Datasheet PDF下载

CRCW120625R0DETAP图片预览
型号: CRCW120625R0DETAP
PDF下载: 下载PDF文件 查看货源
内容描述: 铅(Pb ) -bearing厚膜矩形精密贴片电阻 [Lead (Pb)-bearing Thick Film, Rectangular Precision Chip Resistor]
分类和应用:
文件页数/大小: 5 页 / 111 K
品牌: VAISH [ VAISHALI SEMICONDUCTOR ]
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D../CRCW....-P
Lead (Pb)-bearing Thick Film, Rectangular
Precision Chip Resistor
Temperature Rise in °C
Rated Power in
%
90
80
70
60
50
2010
40
2512
30
20
10
0
0
0.1
0.2
0.3
0.4
0.5
20
0
- 55
40
60
0402 0603 0805
1206
120
100
Vishay
1210
80
- 25
0
25
50
Temperature Rise
Power in W
Derating
75
70
100
125
155 175
Ambient Temperature in °C
TEST PROCEDURES AND REQUIREMENTS
EN 60115-1
TEST (clause)
CONDITIONS OF TEST
Stability for product types:
D../CRCW....-P
Resistance (4.5)
Temperature coefficient (4.8.4.2)
Overload (4.13)
-
20/- 55/20 °C and
20/125/20 °C
U
= 2.5 x (P
70
x
R)
1/2
2 x
U
max.
;
Duration: according the style
Aging 4 h at 155 °C, dryheat
solder bath method; 235 °C; 2 s
visual examination
Solder bath method;
(260 ± 5) °C; (10 ± 1) s
30 min at LCT = - 55 °C;
30 min at UCT = 125 °C; 5 cycles
(40 ± 2) °C; 56 days;
(93 ± 3) % RH
16 h at UCT = 125 °C; 1 cycle at 55 °C;
2 h at LCT = - 55 °C;
1 h/1 kPa at 15 °C to 35 °C;
5 cycles at 55 °C
U
= (P
70
×
R)
1/2
U
=
U
max.
; whichever is less severe
U
= (P
70
×
R)
1/2
U
=
U
max.
; whichever is less severe
1.5 h ON; 0.5 h OFF;
70 °C; 1000 h
Duration extended to 8000 h
UCT = 125 °C; 1000 h
REQUIREMENTS
PERMISSIBLE CHANGE (ΔR/R)
STABILITY CLASS 1 OR BETTER
10R to 10M
± 1 %; ± 0.5 %; ± 0.25 %
± 100 ppm/K; ± 50 ppm/K; ± 100 ppm/K
±
(0.25
%
R
+ 0.05
Ω)
Good tinning
(≥ 95 % covered)
no visible damage
±
(0.25
%
R
+ 0.05
Ω)
±
(0.25
%
R
+ 0.05
Ω)
±
(1
%
R
+ 0.05
Ω)
Solderability (4.17.5)
Resistance to soldering heat
(4.18.2)
Rapid change of temperature (4.19)
Damp heat, steady state (4.24)
Climatic sequence (4.23)
±
(1
%
R
+ 0.05
Ω)
Endurance at 70 °C (4.25.1)
Extended endurance (4.25.1.8)
Endurance at upper category
temperature (4.25.3)
±
(1
%
R
+ 0.05
Ω)
± (2 %
R
+ 0.1
Ω)
± (1 %
R
+ 0.05
Ω)
APPLICABLE SPECIFICATIONS
• EN 60115-1
• EN 140400
• EN 140401-802
• IEC 60068-2-x
• IEC 60286-3
Document Number: 20009
Revision: 13-Oct-08
Generic Specifications
Sectional Specification
Detail Specifications
Variety of environmental test procedures
Packaging of SMD components
For technical questions, contact: filmresistors.thickfilmchip@vishay.com
www.vishay.com
139