CS-300 Clock Smoother
Reflow Profile (IPC/JEDEC J-STD-020C)
Parameter
Symbol
PreHeat Time
Ramp Up
Time Above 217
o
C
Time To Peak Temperature
Time At 260
o
C
Ramp Down
t
S
R
UP
t
L
t
AMB-P
t
P
R
DN
Value
60 sec Min, 180 sec Max
3
o
C/sec Max
60 sec Min, 150 sec Max
480 sec Max
20 sec Min, 40 sec Max
6
o
C/sec Max
The CS-300 is being qualified to meet the
JEDEC standard for Pb-Free assembly. The
temperatures and time intervals listed are
based on the Pb-Free small body
requirements. The temperatures refer to the
topside of the package, measured on the
package body surface. The CS-300 should not
be subjected to a wash process that will
immerse it in solvents. NO CLEAN is the
recommended procedure. The CS-300 has
been designed for pick and place reflow
soldering. The CS-300 may be reflowed once
and should not be reflowed in the inverted
position.
260
t
L
R
t
P
R
DN
t
S
t
AMB-P
Temperature (DegC)
217
200
150
25
Time (sec)
Vectron International, 267 Lowell Road, Hudson, NH 03051
Page 4 of 8
Tel: 1-88-VECTRON-1
•
Web:
www.vectron.com
Rev: 02Jan07
VECTRON [ Vectron International, Inc ]
