SI5935DC-T1-E3 参数 Datasheet PDF下载

Si5935DC

Vishay Siliconix

Dual P-Channel 1.8 V (G-S) MOSFET

PRODUCT SUMMARY

V

DS

(V)

- 20

R

DS(on)

(Ω)

0.086 at V

GS

= - 4.5 V

0.121 at V

GS

= - 2.5 V

0.171 at V

GS

= - 1.8 V

I

D

(A)

- 4.1

- 3.4

- 2.9

FEATURES

•

Halogen-free According to IEC 61249-2-21

Definition

• TrenchFET

®

Power MOSFETs

• Low R

DS(on)

Dual and Excellent Power

Handling in a Compact Footprint

• Compliant to RoHS Directive 2002/95/EC

1206-8 ChipFET

®

1

S

1

D

1

D

1

D

2

D

2

G

1

S

2

G

2

APPLICATIONS

• Load Switch

• PA Switch

• Battery Switch

Marking Code

DF XX

Lot Traceability

and Date Code

Part # Code

S

1

S

2

G

1

G

2

Bottom View

D

1

Ordering Information:

Si5935DC-T1-E3 (Lead (Pb)-free)

Si5935DC-T1-GE3 (Lead (Pb)-free and Halogen-free)

P-Channel MOSFET

D

2

P-Channel MOSFET

ABSOLUTE MAXIMUM RATINGS

T

A

= 25 °C, unless otherwise noted

Parameter

Drain-Source Voltage

Gate-Source Voltage

Continuous Drain Current (T

J

= 150 °C)

a

Pulsed Drain Current

Continuous Source Current (Diode Conduction)

a

Maximum Power Dissipation

a

Operating Junction and Storage Temperature Range

Soldering Recommendations (Peak Temperature)

b, c

T

A

= 25 °C

T

A

= 85 °C

T

A

= 25 °C

T

A

= 85 °C

Symbol

V

DS

V

GS

I

D

I

DM

I

S

P

D

T

J

, T

stg

- 1.8

2.1

1.1

- 55 to 150

260

- 4.1

- 2.9

- 15

- 0.9

1.1

0.6

W

°C

5s

±8

-3

- 2.2

A

Steady State

- 20

Unit

V

THERMAL RESISTANCE RATINGS

Parameter

Maximum Junction-to-Ambient

a

Maximum Junction-to-Foot (Drain)

t

≤

5s

Steady State

Steady State

Symbol

R

thJA

R

thJF

Typical

50

90

30

Maximum

60

110

40

°C/W

Unit

Notes:

a. Surface mounted on 1" x 1" FR4 board.

b. See reliability manual for profile. The ChipFET is a leadless package. The end of the lead terminal is exposed copper (not plated) as a result

of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not required to ensure

adequate bottom side solder interconnection.

c. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.

Document Number: 72220

S10-0936-Rev. C, 19-Apr-10

www.vishay.com

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