BCM
V•I Chip – BCM
Bus Converter Module
TM
B048K096T24
+ +
–
K
–
©
1
V•I
• 48 V to 9.6 V V•I Chip Converter
• 240 Watt (360 Watt for 1 ms)
• High density – up to 960 W/in
3
• Small footprint – 240 W/in
2
• Low weight – 0.5 oz (14 g)
• ZVS/ZCS isolated sine
amplitude converter
• >96% efficiency
• 125°C operation
• <1 µs transient response
• >3.5 million hours MTBF
• No output filtering required
• BGA or J-Lead packages
Vin = 38 - 55 V
Vout = 7.6 - 11 V
Iout = 25 A
K =
1
/
5
Rout = 9.5 mΩ max
Actual size
Product Description
The V•I Chip Bus Converter Module
(BCM) is a high efficiency (>96%),
narrow input range Voltage
Transformation Module (VTM) operating
from a 38 to 55 Vdc primary bus to
deliver an isolated 9.6 V secondary for
Intermediate Bus Architecture applications.
The BCM may be used to power
non-isolated POL converters or as an
independent 7.6 – 11.0 V source. Due to
the fast response time and low noise of
the BCM, the need for limited life
aluminum electrolytic or tantalum
capacitors at the input of POL converters
is reduced—or eliminated—resulting in
savings of board area, materials and total
system cost.
The BCM achieves a power density of
960 W/in
3
and may be surface mounted
with a profile as low as 0.16" (4mm) over
the PCB. Its V•I Chip power package is
compatible with on-board or in-board
surface mounting. The V•I Chip package
provides flexible thermal management
through its low Junction-to-Case and
Junction-to-BGA thermal resistance.
Owing to its high conversion efficiency
and safe operating temperature range, the
BCM does not require a discrete heat sink
in typical applications. It is also available
with heat sink options, assuring low
junction temperatures and long life in the
harshest environments.
Absolute Maximum Ratings
Parameter
+In to -In
+In to -In
PC to -In
TM to -In
+Out to -Out
Isolation voltage
Operating junction temperature
Output current
Peak output current
Case temperature during reflow
Storage temperature
Output power
Peak output power
Values
-1.0 to 60.0
100
-0.3 to 7.0
-0.3 to 7.0
-0.5 to 12.0
2,250
-40 to 125
31.5
37.5
208
-40 to 150
240
360
Unit
Vdc
Vdc
Vdc
Vdc
Vdc
Vdc
°C
A
A
°C
°C
W
W
Notes
For 100 ms
Input to Output
See note 2
Continuous
For 1 ms
Continuous
For 1 ms
Thermal Resistance
Symbol
R
θJC
R
θJB
R
θJA
R
θJA
Parameter
Junction-to-case
Junction-to-BGA
Junction-to-ambient
3
Junction-to-ambient
4
Typ
1.1
2.1
Max
1.5
2.5
Units
°C/W
°C/W
°C/W
°C/W
6.5
5.0
7.2
5.5
Notes
1. For complete product matrix see chart on page 10.
2. The referenced junction is defined as the semiconductor having the highest temperature. This
temperature is monitored by the temperature monitor (TM) signal and by a shutdown comparator.
3. B048K096T24 surface mounted in-board to a 2" x 2" FR4 board, 4 layers 2 oz Cu, 300 LFM.
4. B048K096T24 with optional 0.25"H Pin Fins surface mounted on FR4 board, 300 LFM.
45
Vicor Corporation
Tel: 800-735-6200
vicorpower.com
V•I Chip Bus Converter
B048K096T24
Rev. 1.9
Page 1 of 16
VICOR [ VICOR CORPORATION ]
