PRELIMINARY
V•I Chip Bus Converter Module
B352F110T24
BCM
TM
V•I Chip – BCM
Bus Converter Module
• 352 V to 11.0 V V•I Chip Converter
• 240 Watt (360 Watt for 1 ms)
• High density – up to 876 W/in3
• Small footprint – 210 W/in2
• Low weight – 0.5 oz (14 g)
• Typical efficiency 95%
• 125°C operation
• <1 µs transient response
• >2.6 million hours MTBF
• No output filtering required
©
Vin = 330 - 365 V
Vout = 10.3 - 11.4 V
Iout = 21.8 A
• ZVS/ZCS isolated sine
amplitude converter
Actual size
K = 1/32
Rout = 15.0 mΩ max
Product Description
Absolute Maximum Ratings
The V•I Chip Bus Converter Module (BCM) is a high
efficiency (>95%), narrow input range Sine Amplitude
Converter (SAC) operating from a 330 to 365 Vdc
primary bus to deliver an isolated low voltage secondary.
The off-line BCM provides an isolated 10.3 -11.4 V
distribution bus and is ideal for use in silver boxes and
PFC front ends. Due to the fast response time and low
noise of the BCM, the need for limited life aluminum
electrolytic or tantalum capacitors at the input of POL
converters is reduced—or eliminated—resulting in
savings of board area, materials and total system cost.
Parameter
Values
-1.0 to 400
500
Unit
Vdc
Vdc
Vdc
Vdc
Vdc
A
Notes
+In to -In
+In to -In
For 100 ms
PC to -In
-0.3 to 7.0
-0.5 to 16.0
4,242
+Out to -Out
Isolation voltage
Output current
Peak output current
Output power
Input to Output
Continuous
For 1 ms
24.1
32.7
A
240
W
Continuous
For 1 ms
Peak output power
Case temperature
Operating junction temperature(1)
360
W
The BCM achieves a power density of 876 W/in3 in
a V•I Chip package compatible with standard pick-and-
place and surface mount assembly processes. The V•I
Chip package provides flexible thermal management
through its low Junction-to-Case and Junction-to-Board
thermal resistance. Owing to its high conversion
efficiency and safe operating temperature range, the
BCM does not require a discrete heat sink in typical
applications. Low junction to case and junction to lead
thermal impedances assure low junction temperatures
and long life in the harshest environments.
208
°C
During reflow
T - Grade
-40 to 125
-55 to 125
-40 to 150
-65 to 150
°C
°C
M - Grade
T - Grade
Storage temperature
°C
°C
M - Grade
Note:
(1) The referenced junction is defined as the semiconductor having the highest temperature.
This temperature is monitored by a shutdown comparator.
Part Numbering
B
352
F
110 T
24
Output Voltage
Designator
(=VOUT x10)
Output Power
Designator
(=POUT/10)
Bus Converter
Module
Input Voltage
Designator
Configuration
(Figure 15)
Product Grade Temperatures (°C)
Grade
Storage
Operating
T
M
-40 to150 -40 to125
-65 to150 -55 to125
vicorpower.com
800-735-6200
V•I Chip Bus Converter Module
B352F110T24
Rev. 1.1
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