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BCM352F110T300A00 参数 Datasheet PDF下载

BCM352F110T300A00图片预览
型号: BCM352F110T300A00
PDF下载: 下载PDF文件 查看货源
内容描述: [Analog Circuit, 1 Func, MODULE]
分类和应用:
文件页数/大小: 11 页 / 1603 K
品牌: VICOR [ VICOR CORPORATION ]
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End of Life - BCM352x110T300B00 Recommended  
BCM352F110T300A00  
BCM352T110T300A00  
(Formerly VIB0001TFJ)  
TM  
BCM  
Bus Converter  
• 352 V to 11 V V•I ChipTM Converter  
• 300 Watt (450 Watt for 1 ms)  
• High density – up to 1017 W/in3  
• Small footprint – 260 W/in2  
• Low weight – 0.5 oz (14 g)  
Typical efficiency 95%  
• 125°C operation  
©
• <1 µs transient response  
• >3.5 million hours MTBF  
• No output filtering required  
Vin = 330 - 365 V  
Vout = 10.3 - 11.4 V  
Iout = 28.0 A  
K = 1/32  
Rout = 12.5 m max  
• ZVS / ZCS isolated sine  
amplitude converter  
Product Description  
Absolute Maximum Ratings  
The V•I Chip bus converter is a high efficiency (>95%),  
narrow input range Sine Amplitude ConverterTM (SACTM)  
operating from a 330 to 365 Vdc primary bus to deliver  
an isolated low voltage secondary. The off-line BCM  
provides an isolated 10.3 -11.4 V distribution bus and is  
ideal for use in silver boxes and PFC front ends. Due to  
the fast response time and low noise of the BCM, the  
need for limited life aluminum electrolytic or tantalum  
capacitors at the input of POL converters is reduced—or  
eliminated—resulting in savings of board area, materials  
and total system cost.  
Parameter  
Values  
-1.0 to 400  
500  
Unit  
Vdc  
Vdc  
Vdc  
Vdc  
Vdc  
A
Notes  
+In to -In  
For 100 ms  
PC to -In  
-0.3 to 7.0  
-0.5 to 16.0  
4,242  
+Out to -Out  
Isolation voltage  
Output current  
Peak output current  
Output power  
Peak output power  
Input to Output  
Continuous  
For 1 ms  
Continuous  
For 1 ms  
MSL 5  
28  
42.0  
A
300  
W
450  
W
The BCM achieves a power density of 1017 W/in3 in  
a V•I Chip package compatible with standard pick-and-  
place and surface mount assembly processes. The  
V•I Chip package provides flexible thermal management  
through its low junction-to-case and junction-to-board  
thermal resistance. Owing to its high conversion  
efficiency and safe operating temperature range, the  
BCM does not require a discrete heat sink in typical  
applications. Low junction-to-case and junction-to-lead  
thermal impedances assure low junction temperatures  
and long life in the harshest environments.  
225  
°C  
Case temperature  
245  
°C  
MSL 6  
Operating junction temperature(1)  
Storage temperature  
-40 to 125  
-40 to 125  
°C  
T-Grade  
°C  
T-Grade  
Note:  
(1) The referenced junction is defined as the semiconductor having the highest temperature.  
This temperature is monitored by a shutdown comparator.  
vicorpower.com 800-735-6200 V•I Chip Bus Converter BCM352F110T300A00 & BCM352T110T300A00  
Rev. 1.6  
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