VI Chip®, ChiP™ and VIA™ Packages
BCM® Family
S
®
Isolated, Fixed-Ratio DC-DC Converter Modules
C
NRTL US
For use in three-phase AC industrial power and DC transmission systems for remote unmanned vehicles;
high-end computing systems, industrial systems, telecom/datacom systems and 384VDC power distribution
architectures; 48V intermediate bus architecture power systems, automated test equipment, communication
and transportation
Description
Features & Benefits
Vicor BCMs are power components that provide voltage
• Input range
transformation, current multiplication and isolation for designs
that require high power density, high efficiency, small size and low
weight. Essentially a very small high-frequency DC-DC transformer,
the BCM steps down its input voltage by a range of ratios and
provides galvanic isolation. BCMs support a broad range of output
voltages and power levels. With peak efficiencies of up to 98%
and power densities of up to 2,870W/in³. The family is available
in a variety of temperature grades. The robust VIA package also
provides integrated PMBus communication and EMI filtering. These
flexible modules can be easily paralleled into higher power arrays.
In addition, the BCM outputs can be connected in series to achieve
higher VOUT. Vicor BCM products offer benchmark performance in
a small, cost-effective package.
■■Ultra-high voltage: 400 – 800V input
■■High voltage: 200 – 410V input
(meets ETSI requirements)
■■Low voltage: 36 – 60V input
• High efficiency
■■Ultra-high voltage: Up to 97%
■■High voltage: Up to 98%
■■Low voltage: Up to 97.6%
• High power density
■■Ultra-high voltage: Up to 700W/in³
■■High voltage: Up to 2,735W/in³
■■Low voltage: Up to 2,870W/in³
Utilizing Vicor resonant Sine Amplitude Converter™ (SAC)
topology, BCMs leverage high-frequency Zero-Voltage Switching
(ZVS) and Zero-Current Switching (ZCS) to deliver unmatched
efficiency and power density with low noise and fast transient
response. In addition, the BCM’s low AC impedance, beyond
the bandwidth of most downstream regulators, enables bulk
capacitance, normally located at the input of a regulator, to be
placed at the high-voltage input to the BCM. This reduces bulk
capacitance requirement an offers saving of board area and system
cost. When BCMs operate in reverse, they provide an efficient
step-up conversion.
• Parallel inputs and outputs for high-powered arrays
• Connect outputs in series for higher output voltages
• Bidirectional capability
• VIA Package
■■Available in chassis- or PCB-mount form-factor
■■Simplifies thermal design
■■Provides integrated filtering
■■Available with PMBus® Communication
Offered in a range of package options and power levels, BCMs
provide unmatched performance to meet the demanding
requirements of modern power system designs.
• VI Chip Full and Half
■■SMT or Through-hole form-factor
• ChiP Package
■■Through-hole form-factor
■■PMBus capable
(using Digital Isolator/Digital Supervisor)
BCM6123 ChiP
2.402 x 0.990 x 0.284in
[61.00 x 25.14 x 7.21mm]
BCM3814 VIA
3.76 x 1.40 x 0.37in
(95.59 x 35.54 x 9.40mm)
BCM4414 VIA
4.35 x 1.40 x 0.37in
[110.55 x 35.54 x 9.40mm]
Full VI Chip
1.280 x 0.866 x 0.265in
[32.50 x 22.00 x 6.73mm]
BCM6123 ChiP
2.494 x 0.898 x 0.284in
[63.34 x 22.80 x 7.21mm]
Half VI Chip
0.866 x 0.650 x 0.265in
(22.00 x 16.50 x 6.73mm)
vicorpower.com
Rev 1.0
08/2019
VICOR [ VICOR CORPORATION ]
