D/CRCW e3
Vishay
Standard Thick Film Chip Resistors
FEATURES
Stability R/R = 1 % for 1000 h at 70 ° C
2 mm pitch packaging option for 0603 size
Pure tin solder contacts on Ni barrier layer
provides compatibility with lead (Pb)-free and lead
containing soldering processes
Metal glaze on high quality ceramic
AEC-Q200 qualified
Material categorization: For definitions of compliance
please see www.vishay.com/doc?99912
STANDARD ELECTRICAL SPECIFICATIONS
SIZE
RATED
DISSIPATION
P70 °C
LIMITING
ELEMENT
VOLTAGE
TEMPERATURE
COEFFICIENT
ppm/K
RESISTANCE
RANGE
TOLERANCE
%
MODEL
SERIES
INCH METRIC
W
Umax. AC/DC
100
200
1
5
E24; E96
E24
0.063
50
1R0 to 10M
D10/CRCW0402 0402 RR 1005M
D11/CRCW0603 0603 RR 1608M
D12/CRCW0805 0805 RR 2012M
D25/CRCW1206 1206 RR 3216M
Zero-Ohm-Resistor: Rmax. = 20 m, Imax. at 70 °C = 1.5 A
100
200
1
5
E24; E96
E24
0.10
75
1R0 to 10M
1R0 to 10M
Zero-Ohm-Resistor: Rmax. = 20 m, Imax. at 70 °C = 2.0 A
100
200
1
5
E24; E96
E24
0.125
150
Zero-Ohm-Resistor: Rmax. = 20 m, Imax. at 70 °C = 2.5 A
100
200
1
5
E24; E96
E24
0.25
200
1R0 to 10M
Zero-Ohm-Resistor: Rmax. = 20 m, Imax. at 70 °C = 3.5 A
100
1
5
E24; E96
E24
0.5
200
1R0 to 10M
1R0 to 2M2
200
CRCW1210
CRCW1218
CRCW2010
CRCW2512
1210 RR 3225M
1218 RR 3246M
2010 RR 5025M
2512 RR 6332M
Zero-Ohm-Resistor: Rmax. = 20 m, Imax. at 70 °C = 5.0 A
100
200
1
5
E24; E96
E24
1.0
200
Zero-Ohm-Resistor: Rmax. = 20 m, Imax. at 70 °C = 7.0 A
100
200
1
5
E24; E96
E24
0.75
400
1R0 to 10M
1R0 to 10M
Zero-Ohm-Resistor: Rmax. = 20 m, Imax. at 70 °C = 6.0 A
100
200
1
5
E24; E96
E24
1.0
500
Zero-Ohm-Resistor: Rmax. = 20 m, Imax. at 70 °C = 7.0 A
Notes
These resistors do not feature a limited lifetime when operated within the permissible limits. However, resistance value drift increasing over
operating time may result in exceeding a limit acceptable to the specific application, thereby establishing a functional lifetime.
Marking: See data sheet “Surface Mount Resistor Marking” (document number 20020).
Power rating depends on the max. temperature at the solder point, the component placement density and the substrate material.
Document Number: 20035
Revision: 04-Jun-12
For technical questions, contact: thickfilmchip@vishay.com
www.vishay.com
125
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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