AN822
Vishay Siliconix
130
120
110
100
90
105
Spreading Copper (sq. in.)
Spreading Copper (sq. in.)
95
85
75
65
55
45
80
50 %
100 %
70
100 %
0 %
60
50 %
0 %
50
0.00 0.25 0.50 0.75 1.00 1.25 1.50 1.75 2.00
Figure 6. Spreading Copper - Junction-to-Ambient Performance
0.00 0.25 0.50 0.75 1.00 1.25 1.50 1.75 2.00
Figure 5. Spreading Copper - Si7401DN
CONCLUSIONS
As a derivative of the PowerPAK SO-8, the PowerPAK The PowerPAK 1212-8 combines small size with attrac-
1212-8 uses the same packaging technology and has tive thermal characteristics. By minimizing the thermal
been shown to have the same level of thermal perfor- rise above the board temperature, PowerPAK simplifies
mance while having a footprint that is more than 40 % thermal design considerations, allows the device to run
smaller than the standard TSSOP-8.
cooler, keeps r
low, and permits the device to
DS(ON)
handle more current than a same- or larger-size MOS-
FET die in the standard TSSOP-8 or SO-8 packages.
Recommended PowerPAK 1212-8 land patterns are
provided to aid in PC board layout for designs using this
new package.
www.vishay.com
4
Document Number 71681
03-Mar-06
VISHAY [ VISHAY ]
