Technical Note 71
Assembly Instructions for SCA6x0 and SCA10x0 series
TABLE OF CONTENTS
Table of Contents .....................................................................................................................1
1 Objective ..............................................................................................................................2
2 VTI'S DIL-8 and DIL-12 packages.......................................................................................2
3 Package Outline and Dimensions......................................................................................2
4 Tape and reel specifications ..............................................................................................3
5 Printed Circuit Board (PCB) Level Guidelines ..................................................................5
5.1
5.2
5.3
5.4
5.5
5.6
5.7
5.8
Recommended PCB pad layout................................................................................................5
Solder paste and Cleaning process .........................................................................................5
Stencil .........................................................................................................................................6
Paste printing .............................................................................................................................6
Component picking and placement .........................................................................................6
Reflow soldering ........................................................................................................................6
Moisture sensitivity level (MSL) classification........................................................................7
Inspection ...................................................................................................................................8
6 Hand Soldering Guidelines ................................................................................................9
7 Rework Guidelines ............................................................................................................10
7.1
Instructions for desoldering and removing of component..................................................10
8 Environmental Aspects ....................................................................................................11
9 References.........................................................................................................................11
10 Document Change Control...............................................................................................12
VTI [ VTI TECHNOLOGIES ]
