White Electronic Designs
specified for the clock pin) prior to CKE going back
HIGH. Once CKE is HIGH, the SDRAM must have NOP
commands issued (a minimum of two clocks) for t
XSR
,
because time is required for the completion of any internal
refresh in progress.
Upon exiting the self refresh mode, AUTO REFRESH
commands must be issued as both SELF REFRESH and
AUTO REFRESH utilize the row refresh counter.
W332M72V-XSBX
ABSOLUTE MAXIMUM RATINGS
Parameter
Voltage on V
CC
, V
CCQ
Supply relative to Vss
Voltage on NC or I/O pins relative to Vss
Operating Temperature TA (Mil)
Operating Temperature TA (Ind)
Storage Temperature, Plastic
-1 to 4.6
-1 to 4.6
-55 to +125
-40 to +85
-55 to +125
Unit
V
V
°C
°C
°C
NOTE:
Stress greater than those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating
only and functional operation of the device at these or any other conditions greater than those indicated in the operational sections of
this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability.
CAPACITANCE (NOTE 2)
Parameter
Input Capacitance: CLK
Addresses, BA0-1 Input Capacitance
Input Capacitance: All other input-only pins
Input/Output Capacitance: I/Os
Symbol
CI1
CA
CI2
CIO
Max
7
24
9
9
Unit
pF
pF
pF
pF
BGA THERMAL RESISTANCE
Description
Junction to Ambient (No Airflow)
Junction to Ball
Junction to Case (Top)
NOTE:
Refer to Application Note “PBGA Thermal Resistance Correlation” at www.wedc.com in the
application notes section for modeling conditions.
Symbol
Theta JA
Theta JB
Theta JC
Typical
17.0
16.6
7.4
Unit
C/W
C/W
C/W
Notes
1
1
1
Ju;y 2006
Rev. 3
9
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
WEDC [ WHITE ELECTRONIC DESIGNS CORPORATION ]
