欢迎访问ic37.com |
会员登录 免费注册
发布采购

W3E32M64S-333BM 参数 Datasheet PDF下载

W3E32M64S-333BM图片预览
型号: W3E32M64S-333BM
PDF下载: 下载PDF文件 查看货源
内容描述: 32Mx64 DDR SDRAM [32Mx64 DDR SDRAM]
分类和应用: 内存集成电路动态存储器双倍数据速率
文件页数/大小: 17 页 / 802 K
品牌: WEDC [ WHITE ELECTRONIC DESIGNS CORPORATION ]
 浏览型号W3E32M64S-333BM的Datasheet PDF文件第2页浏览型号W3E32M64S-333BM的Datasheet PDF文件第3页浏览型号W3E32M64S-333BM的Datasheet PDF文件第4页浏览型号W3E32M64S-333BM的Datasheet PDF文件第5页浏览型号W3E32M64S-333BM的Datasheet PDF文件第6页浏览型号W3E32M64S-333BM的Datasheet PDF文件第7页浏览型号W3E32M64S-333BM的Datasheet PDF文件第8页浏览型号W3E32M64S-333BM的Datasheet PDF文件第9页  
White Electronic Designs
32Mx64 DDR SDRAM
FEATURES
DDR SDRAM rate = 200, 250, 266, 333Mb/s
Package:
219 Plastic Ball Grid Array (PBGA),
25mm x 25mm, 625mm
2
W3E32M64S-XBX
BENEFITS
41% SPACE SAVINGS vs. TSOP
Reduced part count
Reduced trace lengths for lower parasitic
capacitance
Suitable for hi-reliability applications
Laminate interposer for optimum TCE match
2.5V ±0.2V core power supply
2.5V I/O (SSTL_2 compatible)
Differential clock inputs (CK and CK#)
Commands entered on each positive CK edge
Internal pipelined double-data-rate (DDR)
architecture; two data accesses per clock cycle
Programmable Burst length: 2,4 or 8
Bidirectional data strobe (DQS) transmitted/
received with data, i.e., source-synchronous data
capture (one per byte)
DQS edge-aligned with data for READs; center-
aligned with data for WRITEs
DLL to align DQ and DQS transitions with CLK
Four internal banks for concurrent operation
Data mask (DM) pins for masking write data
(one per byte)
Programmable I
OL
/I
OH
option
Auto precharge option
Auto Refresh and Self Refresh Modes
Commercial, Industrial and Military
TemperatureRanges
Organized as 32M x 64
User configurable as 2x32Mx32 or 4x32Mx16
Pinout compatible with previous W3E16M64S-XBX
version.
Weight: W3E32M64S-XBX - 2.5 grams typical
GENERAL DESCRIPTION
The 256MByte (2Gb) DDR SDRAM is a high-speed CMOS,
dynamic random-access, memory using 4 chips containing
536,870,912 bits. Each chip is internally configured as a
quad-bank DRAM.
The 256MB DDR SDRAM uses a double data rate
ar chi tec ture to achieve high-speed operation. The
double data rate architecture is essentially a 2n-prefetch
architecture with an interface designed to transfer two data
words per clock cycle at the I/O pins. A single read or write
access for the 256MB DDR SDRAM effectively consists of
a single 2n-bit wide, one-clock-cycle data transfer at the
internal DRAM core and two corresponding n-bit wide,
one-half-clock-cycle data transfers at the I/O pins.
A bi-directional data strobe (DQS) is transmitted externally,
along with data, for use in data capture at the receiver.
strobe transmitted by the DDR SDRAM during READs and
by the memory controller during WRITEs. DQS is edge-
aligned with data for READs and center-aligned with data
for WRITEs. Each chip has two data strobes, one for the
lower byte and one for the upper byte.
The 256MB DDR SDRAM operates from a differential clock
(CK and CK#); the crossing of CK going HIGH and CK#
going LOW will be referred to as the positive edge of CK.
Commands (address and control signals) are registered
at every positive edge of CK. Input data is registered on
both edges of DQS, and output data is referenced to both
* This product subject to change without notice.
July 2006
Rev. 3
1
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com