White Electronic Designs
TABLE 1 – BALL DESCRIPTIONS
Symbol
ODT
Type
Input
Description
W3H64M72E-XSBX
ADVANCED*
On-Die termination: ODT (registered HIGH) enables termination resistance internal to the DDR2 SDRAM. When
enabled, ODT is only applied to each of the following balls: DQ0–DQ71, LDM, UDM, LDQS, LDQS#, UDQS, and
UDQS#. The ODT input will be ignored if disabled via the LOAD MODE command.
Clock: CK and CK# are differential clock inputs. All address and control input signals are sampled on the crossing
of the positive edge of CK and negative edge of CK#. Output data (DQs and DQS/DQS#) is referenced to the
crossings of CK and CK#.
Clock enable: CKE (registered HIGH) activates and CKE (registered LOW) deactivates clocking circuitry on the
DDR2 SDRAM. The specific circuitry that is enabled/disabled is dependent on the DDR2 SDRAM configuration
and operating mode. CKE LOW provides PRECHARGE power-down mode and SELF-REFRESH action (all banks
idle), or ACTIVE power-down (row active in any bank). CKE is synchronous for power-down entry, Power-down
exit, output disable, and for self refresh entry. CKE is asynchronous for self refresh exit. Input buffers (excluding
CKE, and ODT) are disabled during power-down. Input buffers (excluding CKE) are disabled during self refresh.
CKE is an SSTL_18 input but will detect a LVCMO SLOW level once V
CC
is applied during first power-up. After
V
REF
has become stable during the power on and initialization sequence, it must be maintained for proper
operation of the CKE receiver. For proper SELF-REFRESH operation, V
REF
must be maintained.
Chip select: CS# enables (registered LOW) and disables (registered HIGH) the command decoder. All commands
are masked when CS# is registered HIGH.
Command inputs: RAS#, CAS#, WE# (along with CS#) define the command being entered.
Input data mask: DM is an input mask signal for write data. Input data is masked when DM is concurrently sampled
HIGH during a WRITE access. DM is sampled on both edges of DQS. Although DM balls are input-only, the DM
loading is designed to match that of DQ and DQS balls. LDM is DM for lower byte DQ0–DQ7 and UDM is DM for
upper byte DQ8–DQ15, of each of U0-U4
Bank address inputs: BA0–BA2 define to which bank an ACTIVE, READ, WRITE, or PRECHARGE command is
being applied. BA0–BA2 define which mode register including MR, EMR, EMR(2), and EMR(3) is loaded during the
LOAD MODE command.
Continued on next page
CK, CK#
Input
CKE
Input
CS#
RAS#, CAS#,
WE#
Input
Input
LDM, UDM
Input
BA0–BA2
Input
White Electronic Designs Corp. reserves the right to change products or specifications without notice.
March 2006
Rev. 1
4
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
WEDC [ WHITE ELECTRONIC DESIGNS CORPORATION ]
