White Electronic Designs
WED3C7410E16M-XBHX
PRELIMINARY*
7410E RISC Microprocessor HiTCE™ Multichip Package
OVERVIEW
The WEDC 7410E/SSRAM multichip package is targeted
for high performance, space sensitive, low power systems
and supports the following power management features:
doze, nap, sleep and dynamic power management.
The WED3C7410E16M-XBHX multichip package consists
of:
7410E AltiVec™ RISC processor
Dedicated 2MB SSRAM L2 cache, configured as
256Kx72
21mmx25mm, 255 HiTCE™ Ball Grid Array (CBGA)
Core frequency = 450 or 400MHz @ 1.8V
Maximum L2 Cache frequency = 200MHz
Maximum 60x Bus frequency = 100MHz
* This product is under development, is not qualified or characterized and is subject to
change without notice.
The WED3C7410E16M-XBHX is offered in Commercial
(0°C to +70°C), industrial (-40°C to +85°C) and military
(-55°C to +125°C) temperature ranges and is well suited
for embedded applications such as missiles, aerospace,
flight computers, fire control systems and rugged critical
systems.
FEATURES
Footprint compatible with WED3C7410E16M-XBX,
WED3C7558M-XBX and WED3C750A8M-200BX
Implementation of Altivec™ technology instruction
set
Optional, high-bandwidth MPX bus interface
HiTCE™ interposer for TCE compatibility to
laminate substrates for increased Board level
reliability
Available with eutectic or high lead solder balls
FIGURE 1 – MULTI-CHIP PACKAGE DIAGRAM
AltiVec™ is a trademark of Motorola Inc.
HiTCE™ is a trademark of Kyocera Corp.
July 2004
Rev. 0
1
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
WEDC [ WHITE ELECTRONIC DESIGNS CORPORATION ]
