White Electronic Designs
128Kx32 SRAM MODULE, SMD 5962-93187
FEATURES
Access Times of 70, 85, 100, 120ns
MIL-STD-883 Compliant Devices Available
Packaging
• 66-pin, PGA Type, 1.075 inch square, Hermetic
Ceramic HIP (Package 400).
• 68 lead, 40mm Low Profile CQFP, 3.56mm
(0.140")(Package 502).
• 68 lead, Hermetic CQFP (G2U), 22.4mm
(0.880 inch) square, 4.57mm (0.140 inch) high,
(Package 510)
Organized as 128Kx32; User Configurable as
256Kx16 or 512Kx8
Commercial, Industrial and Military Temperature
Ranges
5 Volt Power Supply
Low Power CMOS
WS128K32-XXX
TTL Compatible Inputs and Outputs
Built in Decoupling Caps and Multiple Ground Pins
for Low Noise Operation
Weight
WS128K32-XG2UX - 8 grams typical
WS128K32-XH1X - 13 grams typical
WS128K32-XG4TX - 20 grams typical
Upgradeable to 512Kx32
FIGURE 1 – PIN CONFIGURATION FOR WS128K32N-XH1X
Top View
1
I/O
8
I/O
9
I/O
10
A
14
A
16
A
11
A
0
NC
I/O
0
I/O
1
I/O
2
11
22
12
WE
2
#
CS
2
#
GND
I/O
11
A
10
A
9
A
15
V
CC
CS
1
#
NC
I/O
3
33
23
I/O
15
I/O
14
I/O
13
I/O
12
OE#
NC
WE
1
#
I/O
7
I/O
6
I/O
5
I/O
4
I/O
24
I/O
25
I/O
26
A
7
A
12
NC
A
13
A
8
I/O
16
I/O
17
I/O
18
44
34
V
CC
CS
4
#
WE
4
#
I/O
27
A
4
A
5
A
6
WE
3
#
CS
3
#
GND
I/O
19
55
45
I/O
31
I/O
30
I/O
29
I/O
28
A
1
A
2
A
3
I/O
23
I/O
22
I/O
21
8
OE#
A
0-16
Pin Description
56
I/O
0-31
A
0-16
WE
1-4
#
CS
1-4
#
OE#
V
CC
GND
NC
Data Inputs/Outputs
Address Inputs
Write Enables
Chip Selects
Output Enable
Power Supply
Ground
Not Connected
Block Diagram
WE
1
# CS
1
#
WE
2
# CS
2
#
WE
3
# CS
3
#
WE
4
# CS
4
#
128K x 8
128K x 8
128K x 8
128K x 8
8
8
8
I/O
20
66
I/O
0-7
I/O
8-15
I/O
16-23
I/O
24-31
June 2004
Rev. 4
1
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
WEDC [ WHITE ELECTRONIC DESIGNS CORPORATION ]
