WILLAS
1.0A SURFACE MOUNT SCHOTTKY BARRIER RECTIFIERS -20V- 200V
ESD Protection, SC−89
SOD-123
PACKAGE
•
Batch process design, excellent power dissipation offers
better reverse leakage current and thermal resistance.
•
Low profile surface mounted application in order to
optimize board space.
•
Low power loss, high efficiency.
•
High current capability, low forward voltage drop.
•
High surge capability.
•
Guardring for overvoltage protection.
Features
•
Ultra high-speed switching.
•
Silicon
Low Gate
planar chip, metal
Switching
•
epitaxial
Charge for Fast
silicon junction.
•
Lead-free parts meet environmental standards of
•
Small 1.6 X 1.6 mm Footprint
MIL-STD-19500 /228
•
ESD Protected Gate
•
RoHS product for packing code suffix "G"
Halogen free product for packing code suffix "H"
•
Pb-Free package is available
30 V, 154 mA, Single, N−Channel, Gate
FM120-M
THRU
2N7002NT1
FM1200-M
Pb Free Product
Features
Package outline
SOD-123H
0.146(3.7)
0.130(3.3)
0.012(0.3) Typ.
0.071(1.8)
0.056(1.4)
Mechanical data
packing code suffix ”G”
RoHS product for
: UL94-V0 rated flame
for packing code suffix “H”
•
Epoxy
Halogen free product
retardant
•
Case : Molded plastic, SOD-123H
,
•
Terminals :Plated terminals, solderable per MIL-STD-750
Method
Applications
2026
SC-89
0.024(0.6)
0.031(0.8) Typ.
0.040(1.0)
0.031(0.8) Typ.
Dimensions in inches and (millimeters)
•
Polarity : Indicated by cathode band
•
Power Management Load Switch
Gate
1
•
Mounting Position : Any
•
Level Shift
•
Weight : Approximated 0.011
such as Cell Phones, Media Players,
•
Portable Applications
gram
Digital Cameras, PDA’s, Video Games, Hand Held Computers, etc.
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
3
Drain
Ratings at 25℃ ambient temperature unless otherwise specified.
MAXIMUM RATINGS
(T
J
=
inductive load.
Single phase half wave, 60Hz, resistive of
25°C unless otherwise noted)
For capacitive load, derate current by 20%
Parameter
Symbol Value
RATINGS
Drain−to−Source Voltage
Marking Code
Maximum Recurrent Peak Reverse Voltage
Source
Unit
2
(Top View)
SYMBOL
FM120-M
H FM130-MH
FM140-MH FM150-MH FM160-MH FM180-MH FM1100-MH FM1150-MH FM1200-MH
UNIT
V
DSS
30
V
Gate−to−Source Voltage
Continuous Drain
Maximum RMS Voltage
Current (Note 1)
Maximum DC Blocking Voltage
V
RRM
Steady State = 25°C
V
RMS
12
V
GS
20
I
14
D
20
P
D
13
"10
30
154
21
30
300
14
V
40
mA
28
40
mW
15
50
35
50
16
60
42
60
1.0
30
40
120
18
80
56
10
100
70
115
150
105
120
200
140
200
Volts
Volts
Volts
Amps
V
DC
Power Dissipation
Steady State = 25°C
Maximum Average Forward Rectified Current
I
O
(Note 1)
t
P
v
10
Peak Forward
Pulsed Drain
8.3 ms single half sine-wave
ms
Surge Current
Current
I
FSM
superimposed
Operating Junction and Storage Temperature
on rated load (JEDEC method)
Typical Thermal Resistance (Note 2)
R
ΘJA
Typical Junction Capacitance (Note 1)
Continuous Source Current (Body Diode)
C
J
Operating Temperature Range
T
J
80
MARKING DIAGRAM
100
150
3
I
DM
T
J
,
T
STG
I
SD
T
L
618
−55 to
150
-55 to +125
260
mA
°C
mA
°C
T6
M
Amps
℃/W
154
1
2
PF
℃
℃
Lead Temperature for Soldering Purposes
Storage Temperature Range
for 10 s)
TSTG
(1/8″ from case
-55 to +150
TF = Specific Device Code
-
65
to +175
M = Month Code
THERMAL RESISTANCE RATINGS
CHARACTERISTICS
SYMBOL
Maximum Forward Voltage at 1.0A DC
Parameter
Rated DC Blocking Voltage
FM120-MH
FM130-MH FM140-MH FM150-MH FM160-MH FM180-MH FM1100-MH
FM1150-MH
FM1200-MH
UNIT
V
F
Maximum Average Reverse Current at @T A=25℃
Symbol
R
qJA
0.50
Unit
Max
0.70
Device
10
0.85
0.9
0.92
Volts
mAmps
I
1)
Junction−to−Ambient – Steady State (Note
R
@T A=125℃
416
°C/W
0.5
ORDERING INFORMATION
Marking
T6
Shipping
3000/Tape&Reel
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and
of 4.0 VDC.
1- Measured at 1 MHZ and applied reverse voltage
are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
2- Thermal Resistance From Junction to Ambient
reliability may be affected.
1. Surface−mounted on FR4 board using 1 in sq pad size
(Cu area = 1.127 in sq [1 oz] including traces).
NOTES:
7002NT1
2012-06
WILLAS ELECTRONIC CORP.
2012-0
WILLAS ELECTRONIC CORP.