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8050HXLT1 参数 Datasheet PDF下载

8050HXLT1图片预览
型号: 8050HXLT1
PDF下载: 下载PDF文件 查看货源
内容描述: 通用晶体管 [General Purpose Transistors]
分类和应用: 晶体晶体管
文件页数/大小: 3 页 / 297 K
品牌: WILLAS [ WILLAS ELECTRONIC CORP ]
 浏览型号8050HXLT1的Datasheet PDF文件第2页浏览型号8050HXLT1的Datasheet PDF文件第3页  
General
MOUNT SCHOTTKY
Transistors
-20V- 200V
1.0A SURFACE
Purpose
BARRIER RECTIFIERS
SOD-123
Batch process design, excellent power dissipation offers
WILLAS
FM120-M
8050HxLT1
THRU
FM1200-M
PACKAGE
Pb Free Product
Features
Package outline
SOD-123H
NPN Silicon
optimize board space.
better reverse leakage current and thermal resistance.
Low profile surface mounted application in order to
Low power loss, high efficiency.
High current capability, low forward voltage drop.
FEATURE
High surge capability.
Guardring
capacity in compact package.
High current
for overvoltage protection.
I
C
=1.5A.
Ultra high-speed switching.
Silicon
planar type.
Epitaxial
epitaxial planar chip, metal silicon junction.
Lead-free parts meet environmental standards of
NPN complement: 8050H
MIL-STD-19500 /228
We declare that the material of product compliance with RoHS requirements.
RoHS product for packing code suffix "G"
Pb-Free package is available
Halogen free product for packing code suffix "H"
0.146(3.7)
0.130(3.3)
0.012(0.3) Typ.
0.071(1.8)
0.056(1.4)
SOT–23
COLLECTOR
3
0.040(1.0)
0.024(0.6)
Mechanical data
packing code suffix “H”
Halogen free product for
RoHS product for packing code suffix ”G”
ry
0.031(0.8) Typ.
Epoxy : UL94-V0 rated flame retardant
DEVICE MARKING AND ORDERING INFORMATION
Case : Molded plastic, SOD-123H
,
Shipping
Device
Marking
Terminals :Plated terminals, solderable per MIL-STD-750
8050HPLT1
Method 2026
1HA
1
0.031(0.8) Typ.
BASE
3000/Tape&Reel
3000/Tape&Reel
3000/Tape&Reel
3000/Tape&Reel
8050HSLT1
1HG
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25℃
RATINGS
MAXIMUM
ambient temperature unless otherwise specified.
Single phase half wave, 60Hz, resistive of inductive load.
Symbol
Rating
For capacitive load, derate current by 20%
Collector-Emitter Voltage
V
CEO
im
V
EBO
12
I
C
20
14
 
Collector-Base
RATINGS
Voltage
Marking
Emitter-Base Voltage
Code
Maximum RMS Voltage
25
V
40
V
SYMBOL
V
CBO
FM120-M
H FM130-MH
FM140-MH FM150-MH FM160-MH FM180-MH FM1100-MH FM1150-MH FM1200-MH
V
RRM
V
RMS
V
DC
I
O
13
5
30
1500
21
30
14
40
28
40
Pr
el
ina
Max
Unit
V
15
50
mAdc
35
50
8050HQLT1
Polarity : Indicated by cathode band
1HC
Mounting Position : Any
8050HRLT1
1HE
Weight : Approximated 0.011 gram
2
EMITTER
Dimensions in inches and (millimeters)
Collector Current-continuoun
Maximum Recurrent Peak Reverse Voltage
16
60
42
60
1.0
 
30
40
120
18
80
56
80
10
100
70
100
115
150
105
150
120
200
140
200
THERMAL CHARACTERISTICS
Maximum DC Blocking Voltage
 
Characteristic
Maximum Average Forward Rectified Current
T
A
=25°C
superimposed on rated load (JEDEC method)
Derate above 25°C
Typical Thermal Resistance (Note 2)
Typical Junction Capacitance (Note 1)
Operating Temperature Range
Symbol
P
D
20
Max
225
Unit
mW
mW/°C
°C/W
Peak Forward Surge Current 8.3 ms single half sine-wave
Total Device Dissipation FR-5 Board,(1)
 
I
FSM
 
 
R
ΘJA
C
J
T
J
TSTG
 
R
θ
J A
P
D
Thermal Resistance,Junction to Ambient
556
-55 to +125
300
 
1.8
 
-55 to +150
 
-
65
to +175
Total Device Dissipation
Storage Temperature Range
 
Alumina Substrate,(2) TA=25°C
Maximum Forward Voltage at 1.0A DC
Maximum
Thermal Resistance,Junction
@T
Ambient
Average Reverse Current at
to
A=25℃
Rated DC Blocking Voltage
@T A=125℃
Derate above 25°C
CHARACTERISTICS
mW
mW/°C
0.70
°C/W
°C
0.85
0.5
10
0.9
0.92
 
SYMBOL
FM120-MH
FM130-MH FM140-MH FM150-MH FM160-MH FM180-MH FM1100-MH
FM1150-MH
FM1200-MH
V
F
I
R
2.4
0.50
R
θ
J A
T
j,
T
S
t
g
417
-55 to +150
 
Junction and Storage Temperature
NOTES:
1- Measured at 1 MHZ and applied reverse voltage of 4.0 VDC.
2- Thermal Resistance From Junction to Ambient
 
 
2012-
2012-06
WILLAS ELECTRONIC CORP
WILLAS ELECTRONIC CORP.