ISD1700 SERIES
TABLE OF CONTENTS
1
2
3
4
5
6
GENERAL DESCRIPTION ..............................................................................................................3
FEATURES......................................................................................................................................4
BLOCK DIAGRAM...........................................................................................................................5
PINOUT CONFIGURATION............................................................................................................6
PIN DESCRIPTION .........................................................................................................................7
MODES OF OPERATIONS .............................................................................................................8
6.1 Standalone (Push-Button) Mode .............................................................................................8
6.2 SPI Mode .................................................................................................................................8
7
TIMING DIAGRAMS ........................................................................................................................8
7.1 Standalone Operation ..............................................................................................................8
7.2 SPI Operation.........................................................................................................................12
8
9
ABSOLUTE MAXIMUM RATINGS ................................................................................................13
8.1 Operating Conditions .............................................................................................................13
ELECTRICAL CHARACTERISTICS .............................................................................................14
9.1 DC Parameters ......................................................................................................................14
9.2 AC Parameters.......................................................................................................................15
10
11
TYPICAL APPLICATION CIRCUITS.............................................................................................16
10.1 Good Audio Design Practices ................................................................................................18
PACKAGING .................................................................................................................................19
11.1 28-Lead 8x13.4mm Plastic Thin Small Outline Package (TSOP) Type 1 - IQC....................19
11.2 28-Lead 300-Mil Plastic Small Outline Integrated Circuit (SOIC)..........................................20
11.3 28-Lead 600-Mil Plastic Dual Inline Package (PDIP) ............................................................21
11.4 Die Information.......................................................................................................................21
12
13
ORDERING INFORMATION .........................................................................................................22
VERSION HISTORY......................................................................................................................23
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WINBOND [ WINBOND ]
