W25X16, W25X32, W25X64
Table of Contents
1.
2.
3.
4.
5.
6.
7.
8.
GENERAL DESCRIPTION ......................................................................................................... 4
FEATURES ................................................................................................................................. 4
PIN CONFIGURATION SOIC 208-MIL....................................................................................... 5
PIN CONFIGURATION WSON 6X5-MM .................................................................................... 5
PIN CONFIGURATION PDIP 300-MIL ....................................................................................... 6
PIN DESCRIPTION SOIC 208-MIL, PDIP 300-MIL, AND WSON 6X5-MM ............................... 6
PIN CONFIGURATION SOIC 300-MIL....................................................................................... 7
PIN DESCRIPTION SOIC 300-MIL ............................................................................................ 7
8.1
8.2
8.3
8.4
8.5
8.6
8.7
9.
10.
Package Types ............................................................................................................... 8
Chip Select (/CS) ............................................................................................................ 8
Serial Data Output (DO) ................................................................................................. 8
Write Protect (/WP)......................................................................................................... 8
HOLD (/HOLD) ............................................................................................................... 8
Serial Clock (CLK) .......................................................................................................... 8
Serial Data Input / Output (DIO) ..................................................................................... 8
BLOCK DIAGRAM ...................................................................................................................... 9
FUNCTIONAL DESCRIPTION ................................................................................................. 10
10.1
SPI OPERATIONS ....................................................................................................... 10
10.1.1
10.1.2
10.1.3
SPI Modes ....................................................................................................................10
Dual Output SPI............................................................................................................10
Hold Function ...............................................................................................................10
Write Protect Features..................................................................................................11
10.2
11.
WRITE PROTECTION.................................................................................................. 11
10.2.1
CONTROL AND STATUS REGISTERS................................................................................... 12
11.1
STATUS REGISTER .................................................................................................... 12
11.1.1
11.1.2
11.1.3
11.1.4
11.1.5
11.1.6
11.1.7
BUSY............................................................................................................................12
Write Enable Latch (WEL) ............................................................................................12
Block Protect Bits (BP2, BP1, BP0)..............................................................................12
Top/Bottom Block Protect (TB) .....................................................................................12
Reserved Bits ...............................................................................................................12
Status Register Protect (SRP) ......................................................................................13
Status Register Memory Protection ..............................................................................14
Manufacturer and Device Identification.........................................................................16
Instruction Set...............................................................................................................17
Write Ensable (06h)......................................................................................................18
11.2
INSTRUCTIONS........................................................................................................... 16
11.2.1
11.2.2
11.2.3
-2-
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