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W29F102Q-50 参数 Datasheet PDF下载

W29F102Q-50图片预览
型号: W29F102Q-50
PDF下载: 下载PDF文件 查看货源
内容描述: 64K 16 CMOS FLASH MEMORY [64K 16 CMOS FLASH MEMORY]
分类和应用:
文件页数/大小: 21 页 / 253 K
品牌: WINBOND [ WINBOND ]
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W29F102  
FUNCTIONAL DESCRIPTION  
Read Mode  
The read operation of the W29F102 is controlled by CE and OE, both of which have to be low for  
the host to obtain data from the outputs. CE is used for device selection. When CE is high, the chip  
is de-selected and only standby power will be consumed. OE is the output control and is used to gate  
data from the output pins. The data bus is in high impedance state when either CE or OE is high.  
Refer to the timing waveforms for further details.  
Boot Block Operation  
There is one 8K-word boot block in this device, which can be used to store boot code. It is located in  
the first 8K words of the memory with the address range from 0000 hex to 1FFF hex.  
See Command Codes for Boot Block Lockout Enable for the specific code. Once this feature is set  
the data for the designated block cannot be erased or programmed (programming lockout); other  
memory locations can be changed by the regular programming method. Once the boot block  
programming lockout feature is activated, the chip erase function will only affect the main memory.  
In order to detect whether the boot block feature is set on the 8K-words block, users can perform  
software command sequence: enter the product identification mode (see Command Codes for  
Identification/Boot Block Lockout Detection for specific code), and then read from address "0002  
hex". If the output data is "FF hex," the boot block programming lockout feature is activated; if the  
output data is "FE hex," the lockout feature is inactivated and the block can be erased/programmed.  
To return to normal operation, perform a three-byte command sequence (or an alternate single-word  
command) to exit the identification mode. For the specific code, see Command Codes for  
Identification/Boot Block Lockout Detection.  
Chip Erase Operation  
The chip-erase mode can be initiated by a six-word command sequence. After the command loading  
cycle, the device enters the internal chip erase mode, which is automatically timed and will be  
completed in a fast 100 mS (typical). The host system is not required to provide any control or timing  
during this operation. If the boot block programming lockout is activated, only the data in the main  
memory will be erased to FF(hex), and the data in the boot block will not be erased (remains same as  
before the chip erase operation). The entire memory array (main memory and boot block) will be  
erased to FF hex. by the chip erase operation if the boot block programming lockout feature is not  
activated. The device will automatically return to normal read mode after the erase operation  
completed. Data polling and/or Toggle Bits can be used to detect end of erase cycle.  
Main Memory Erase Operation  
The main memory erase mode can be initiated by a six-word command sequence. After the  
command loading cycle, the device enters the internal main-memory erase mode, which is  
automatically timed and will be completed in a fast 100 mS (typical). The host system is not required  
to provide any control or timing during this operation. The device will automatically return to normal  
read mode after the erase operation completed. Data polling and/or Toggle Bits can be used to detect  
end of erase cycle.  
Publication Release Date: June 1999  
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Revision A4