W25X16 ， W25X32 ， W25X64
目录
1.
2.
3.
4.
5.
6.
7.
8.
概述......................................................................................................... 4
特点................................................................................................................................. 4
引脚配置SOIC 208- MIL ............................................ ........................................... 5
引脚配置WSON 6X5 -MM ............................................ ........................................ 5
引脚配置PDIP 300 - MIL ............................................ ........................................... 6
引脚说明SOIC 208 - MIL ， PDIP 300 - MIL ，和WSON 6X5 -MM ............................... 6
引脚配置SOIC 300 MIL ............................................ ........................................... 7
引脚说明SOIC 300 MIL ............................................ ................................................ 7
8.1
8.2
8.3
8.4
8.5
8.6
8.7
9.
10.
封装类型............................................................................................................... 8
片选（ / CS ） ............................................................................................................ 8
串行数据输出（ DO ） ............................................ .................................................. 8 ...
写保护(/WP)......................................................................................................... 8
HOLD （ / HOLD ） ............................................................................................................... 8
串行时钟（CLK ） .......................................................................................................... 8
串行数据输入/输出（ DIO ） .......................................... ........................................... 8
框图...................................................................................................................... 9
功能说明................................................ ................................................. 10
10.1
SPI OPERATIONS ....................................................................................................... 10
10.1.1
10.1.2
10.1.3
SPI模式....................................................................................................................10
双输出SPI............................................................................................................10
保持功能...............................................................................................................10
写保护Features..................................................................................................11
10.2
11.
写PROTECTION.................................................................................................. 11
10.2.1
控制和状态寄存器.............................................. ..................................... 12
11.1
状态寄存器................................................ .................................................. .. 12
11.1.1
11.1.2
11.1.3
11.1.4
11.1.5
11.1.6
11.1.7
BUSY............................................................................................................................12
写使能锁存器（ WEL ） ............................................ ................................................ 12
块保护位（ BP2 ， BP1 ， BP0 ） ........................................ ...................................... 12
顶部/底部块保护（ TB） .......................................... ........................................... 12
保留位...............................................................................................................12
状态寄存器保护（ SRP ） ............................................ .......................................... 13
状态寄存器内存保护.............................................. ................................ 14
制造商和设备标识.............................................. ........................... 16
指令Set...............................................................................................................17
写Ensable (06h)......................................................................................................18
11.2
INSTRUCTIONS........................................................................................................... 16
11.2.1
11.2.2
11.2.3
-2-
WINBOND [ WINBOND ]
