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AG302-86 参数 Datasheet PDF下载

AG302-86图片预览
型号: AG302-86
PDF下载: 下载PDF文件 查看货源
内容描述: 的InGaP HBT增益模块 [InGaP HBT Gain Block]
分类和应用: 射频微波
文件页数/大小: 6 页 / 456 K
品牌: WJCI [ WJ COMMUNICATION. INC. ]
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AG302-86
InGaP HBT Gain Block
The Communications Edge
TM
Product Information
AG302-86 (SOT-86 Package) Mechanical Information
This package may contain lead-bearing materials. The plating material on the leads is SnPb.
Outline Drawing
Product Marking
The component will be marked with a “D”
designator followed by a two-digit numeric
lot code on the top surface of the package.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
MSL / ESD Rating
ESD Rating:
Value:
Test:
Standard:
ESD Rating:
Value:
Test:
Standard:
Class 0
Passes at 150 V
Human Body Model (HBM)
JEDEC Standard JESD22-A114
Class II
Passes at 250 V
Charged Device Model (CDM)
JEDEC Standard JESD22-C101
Land Pattern
MSL Rating: Level 1
Standard:
JEDEC Standard J-STD-020A
Mounting Config. Notes
1. Ground / thermal vias are critical for the proper performance
of this device. Vias should use a .35mm (#80 / .0135” )
diameter drill and have a final plated thru diameter of .25 mm
(.010” ).
2. Add as much copper as possible to inner and outer layers near
the part to ensure optimal thermal performance.
3. Mounting screws can be added near the part to fasten the
board to a heatsink. Ensure that the ground / thermal via
region contacts the heatsink.
4. Do not put solder mask on the backside of the PC board in the
region where the board contacts the heatsink.
5. RF trace width depends upon the PC board material and
construction.
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are in
degrees.
Thermal Specifications
Parameter
Operating Case Temperature
Thermal Resistance, Rth
(1)
Junction Temperature, Tjc
(2)
MTTF (million hrs)
Rating
1000
MTTF vs. GND Pin Temperature
-40 to +85
qC
310
qC/W
131
qC
100
1. The thermal resistance is referenced from the hottest part
of the junction to the ground lead (pin 2 or 4).
2. This corresponds to the typical biasing condition of
+4.23V, 35 mA at an 85 C case temperature. A
minimum MTTF of 1 million hours is achieved for
junction temperatures below 177 C.
£
£
10
1
60
70
80
90
100
GND Pin Temperature (°C)
110
Specifications and information are subject to change without notice
¢
¢
¢
¢
WJ Communications, Inc
Phone 1-800-WJ1-4401
FAX: 408-577-6621
e-mail: sales@wj.com
Web site: www.wj.com
Page 5 of 6 June 2005