0.2 Watt, High Linearity InGaP HBT Amplifier
AH110
The Communications Edge
TM
Product Information
This package is lead-free/Green/RoHS-compliant. The plating material on the leads is NiPdAu. It is compatible with both lead-free
(maximum 260
qC
reflow temperature) and leaded (maximum 245
qC
reflow temperature) soldering processes.
AH110-89G Mechanical Information
Outline Drawing
Product Marking
The component will be marked with an
“AH110G” designator with an alphanumeric lot
code on the top surface of the package. The
obsolete tin-lead package is marked with
“AH110”
designator followed by an
alphanumeric lot code.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
MSL / ESD Rating
Land Pattern
ESD Rating:
Value:
Test:
Standard:
Class 1A
Passes between 250 and 500V
Human Body Model (HBM)
JEDEC Standard JESD22-A114
T
MSL Rating: Level 3 at +260 C convection reflow
Standard:
JEDEC Standard J-STD-020
Mounting Config. Notes
1. Ground / thermal vias are critical for the proper performance of this
device. Vias should use a .35mm (#80 / .0135” ) diameter drill and
have a final plated thru diameter of .25 mm (.010” ).
2. Add as much copper as possible to inner and outer layers near the
part to ensure optimal thermal performance.
3. Mounting screws can be added near the part to fasten the board to a
heatsink. Ensure that the ground / thermal via region contacts the
heatsink.
4. Do not put solder mask on the backside of the PC board in the
region where the board contacts the heatsink.
5. RF trace width depends upon the PC board material and
construction.
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are in degrees.
Thermal Specifications
Parameter
Operating Case Temperature
Thermal Resistance, Rth
(1)
Junction Temperature, Tj
(2)
Rating
100000
MTTF vs. GND Tab Temperature
Notes:
1. The thermal resistance is referenced from the junction-
to-case at a case temperature of 85 C.
2. This corresponds to the typical biasing condition of
+5V, 100 mA at an 85 C case temperature. A
minimum MTTF of 1 million hours is achieved for
junction temperatures below 247 C.
T
T
T
-40 to +85
qC
128
qC
/ W
149
qC
10000
1000
100
60
70
80
90
100
110
120
Tab Temperature (°C)
Specifications and information are subject to change without notice
S
S
S
S
WJ Communications, Inc
Phone 1-800-WJ1-4401
FAX: 408-577-6621
e-mail: sales@wj.com
Web site: www.wj.com
Page 5 of 5 June 2006
WJCI [ WJ COMMUNICATION. INC. ]
