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AH114-89G 参数 Datasheet PDF下载

AH114-89G图片预览
型号: AH114-89G
PDF下载: 下载PDF文件 查看货源
内容描述: 1/4瓦,高线性度的InGaP HBT放大器 [ Watt, High Linearity InGaP HBT Amplifier]
分类和应用: 放大器射频微波
文件页数/大小: 6 页 / 295 K
品牌: WJCI [ WJ COMMUNICATION. INC. ]
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AH114
¼ Watt, High Linearity InGaP HBT Amplifier
The Communications Edge
TM
Product Information
AH114-89G (Green / Lead-free SOT-89 Package) Mechanical Information
This package is lead-free/Green/RoHS-compliant. It is compatible with both lead-free (maximum 260
C
reflow temperature) and leaded
(maximum 245
C
reflow temperature) soldering processes. The plating material on the leads is NiPdAu.
Outline Drawing
Product Marking
The component will be marked with an
“AH114
G”
designator with an alphanumeric lot
code on
the top surface of the package. The obsolete tin-
lead package is marked with an
“AH114”
or
“E009”
designator followed by an alphanumeric
lot code.
Tape and reel specifications for this part are
located on the website in the
“Application
Notes” section.
ESD / MSL Information
Land Pattern
ESD Rating: Class 1A
Test:
Human Body Model (HBM)
Standard:
JEDEC Standard JESD22-A114
MSL Rating: Level 3 at +260
C
convection reflow
Standard:
JEDEC Standard J-STD-020
Mounting Config. Notes
1. Ground / thermal vias are critical for the proper performance of this
device. Vias should use a .35mm (#80 / .0135”)
diameter drill and
have a final plated thru diameter of .25 mm (.010”).
2. Add as much copper as possible to inner and outer layers near the
part to ensure optimal thermal performance.
3. Mounting screws can be added near the part to fasten the board to a
heatsink. Ensure that the ground / thermal via region contacts the
heatsink.
4. Do not put solder mask on the backside of the PC board in the
region where the board contacts the heatsink.
5. RF trace width depends upon the PC board material and
construction.
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are in degrees.
Thermal Specifications
Parameter
Operating Case Temperature
Thermal Resistance, Rth
(1)
Junction Temperature, Tj
(2)
Rating
-40 to +85
C
149
C
/ W
197
C
MTTF vs. GND Tab Temperature
1000.0
Notes:
1. The thermal resistance is referenced from the junction-to-case at a case
temperature of 85
C.
2. This corresponds to the typical biasing condition of +5V, 150 mA at an 85
C
case temperature. A minimum MTTF of 1 million hours is achieved
for junction temperatures below 247
C.
MTTF (million hrs)
100.0
10.0
1.0
60
70
80
90
100 110
Tab Temperature (°C)
120
Specifications and information are subject to change without notice
WJ Communications, Inc
Phone 1-800-WJ1-4401
FAX: 408-577-6621
e-mail: sales@wj.com
Page 6 of 6 November 2006