AH3
The Communications Edge
TM
Product Information
High Dynamic Range Gain Block
This package is lead-free/Green/RoHS-compliant. It is compatible with both lead-free (maximum 260
°C
reflow temperature) and leaded
(maximum 245
°C
reflow temperature) soldering processes. The plating material on the leads is NiPdAu.
AH3-G Mechanical Information
Outline Drawing
Product Marking
The AH3-G will be marked with an “AH3G”
designator.
An alphanumeric lot code
(“XXXX-X”) is also marked below the part
designator on the top surface of the package.
The obsolete tin-lead package is marked with
“AH3” designator followed by alphanumeric
lot code.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
MSL / ESD Rating
Land Pattern
ESD Rating:
Value:
Test:
Standard:
ESD Rating:
Value:
Test:
Standard:
Class 1B
Passes 500V to <1000V
Human Body Model (HBM)
JEDEC Standard JESD22-A114
Class IV
Passes 1000V to <2000V
Charged Device Model (CDM)
JEDEC Standard JESD22-C101
MSL Rating: Level 3 at +260
°C
convection reflow
Standard:
JEDEC Standard J-STD-020
Mounting Config. Notes
1. Ground / thermal vias are critical for the proper
performance of this device. Vias should use a .35mm
(#80 / .0135”) diameter drill and have a final plated thru
diameter of .25 mm (.010”).
2. Add as much copper as possible to inner and outer layers
near the part to ensure optimal thermal performance.
3. Mounting screws can be added near the part to fasten the
board to a heatsink. Ensure that the ground / thermal via
region contacts the heatsink.
4. Do not put solder mask on the backside of the PC board in
the region where the board contacts the heatsink.
5. RF trace width depends upon the PC board material and
construction.
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are in
degrees.
Thermal Specifications
Parameter
Operating Case Temperature
Thermal Resistance, Rth
(1)
Junction Temperature, Tj
(2)
MTTF vs. GND Tab Temperature
1000
-40 to +85
°C
59
°C
/ W
129
°C
M T T F (m illio n h rs )
Rating
100
10
1. The thermal resistance is referenced from the hottest
part of the junction to the ground tab (pin 4).
2. This corresponds to the typical biasing condition of
+5V, 150 mA at an 85°C case temperature. A
minimum MTTF of 1 million hours is achieved for
junction temperatures below 160
°C.
1
60
70
80
90
100
Tab Temperature (°C)
110
Specifications and information are subject to change without notice.
WJ Communications, Inc
•
Phone 1-800-WJ1-4401
•
FAX: 408-577-6621
•
e-mail: sales@wj.com
•
Web site: www.wj.com
Page 4 of 4 April 2006
WJCI [ WJ COMMUNICATION. INC. ]
