Advanced Information
WM8753L
PIN CONFIGURATION - BGA
PIN CONFIGURATION - QFN
MODE/GPIO3
CSB/GPIO5
MIC2N
MIC1N
GPIO4
VXDIN
SCLK
SDIN
MIC2
MIC1
RXN
48 47 46 45 44 43 42 41 40 39 38 37
VXDOUT
VXCLK
VXFS
LRC
BCLK
ADCDAT
DACDAT
MCLK
DBVDD
DCVDD
DGND
PCMCLK
1
2
3
4
5
6
36
35
34
33
32
31
LINE2
LINE1
ACOP
ACIN
MICBIAS
VMID
VREF
AGND
AVDD
MONO1
MONO2
SPKRVDD
WM8753LEFL
7
8
9
10
11
12
13 14 15 16 17 18 19 20 21 22 23 24
GP1/CLK1
GP2/CLK2
LOUT1
HPVDD
ROUT1
HP/SPKRGND
ROUT2
LOUT2
PGND
PVDD
OUT4
OUT3
30
29
28
27
26
25
ORDERING INFORMATION
ORDER CODE
WM8753LGEFL/V
WM8753LGEFL/RV
WM8753LEB/V
WM8753LEB/RV
Note:
QFN Reel quantity = 2,200
BGA Reel quantity = 3,500
TEMPERATURE
RANGE
-25°C to +85°C
-25°C to +85°C
-25°C to +85°C
-25°C to +85°C
PACKAGE
48-pin QFN (7x7x0.9mm)
(lead free)
48-pin QFN (7x7x0.9mm)
(lead free, tape and reel)
52-pin BGA (5x5x0.9mm)
52-pin BGA (5x5x0.9mm)
(tape and reel)
MOISTURE
SENSITIVITY LEVEL
MSL3
MSL3
MSL3
MSL3
PEAK SOLDERING
TEMPERATURE
260
o
C
260
o
C
240
o
C
240
o
C
w
RXP
AI Rev 3.1 June 2004
4
WOLFSON [ WOLFSON MICROELECTRONICS PLC ]
