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Ultra Low Power Audio Subsystem
DESCRIPTION
The WM9093 is a high performance low power audio
subsystem, including headphone driver and Class AB/D
earpiece/speaker driver. The Class D speaker driver
supports 650mW output power at 3.6V, 1%THD.
The unique dual mode charge pump architecture provides
ground referenced headphone outputs removing the
requirement for external coupling capacitors. Class G
technology is integrated to increase the efficiency and
extend playback time by optimizing the headphone driver
supply voltages according to the volume control.
The flexible input configuration allows single ended or
differential stereo inputs. Mixers allow highly flexible routing
to the outputs. A ‘Voice Bypass’ path is also available for
low-power voice applications.
The WM9093 is controlled using a two-wire I2C interface.
An integrated oscillator generates all internal clocks,
removing the need to provide any external clock.
Separate mixer and volume controls are provided for each
headphone and speaker driver. Automatic Gain Control
limits the speaker output signal in order to prevent clipping.
DC offset correction to less than 1mV guarantees a
pop/click-free headphone start up.
The WM9093 is available in a 2.0mm x 2.5mm 20-bump
CSP package.
[1]
WM9093
FEATURES
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Mono Class D speaker driver
2W at 5V SVDD @1%THD+N into 4Ω
650mW at 3.6V SVDD @1%THD+N into 8Ω
92dB SNR
Ground referenced stereo headphone driver
34mW into 16Ω load @ 1% THD+N
96dB SNR
80dB THD+N
Mono Class AB earpiece driver
40mW into 8Ω load
Differential and single ended analogue input configurations
Integrated oscillator for clocking requirements
2
I C 2-wire software control interface
Automatic gain control (AGC) for Class D speaker output
Pop and click suppression, < 1mV DC offset
<50ms start up time
Excellent RF and TDMA noise immunity
Ultra low power consumption
4mW quiescent for headphone driver
5mW quiescent for speaker driver (Class D)
Shutdown current < 1uA
Supply voltage
SVDD = 2.7V to 5.5V
HPVDD = 1.8V
1.8V to 2.7V control interface compatibility
20-bump CSP package
APPLICATIONS
Mobile handsets
BLOCK DIAGRAM
WOLFSON MICROELECTRONICS plc
[1] This product is protected by US Patents 7,622,984 and 7,626,445
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Production Data, March 2012, Rev 4.2
Copyright
2012
Wolfson Microelectronics plc
WOLFSON [ WOLFSON MICROELECTRONICS PLC ]
