WM9705
Production Data
ORDERING INFORMATION
DEVICE
XWM9705EFT/V
WM9705SEFT/V
XWM9705EFT/RV
WM9705SEFT/RV
TEMP. RANGE
-25 to 85
o
C
-25 to 85
o
C
-25 to 85
o
C
-25 to 85
o
C
PACKAGE
48-pin TQFP
48-pin TQFP
(lead free)
48-pin TQFP
(tape and reel)
48-pin TQFP
(lead free, tape and reel)
MOISTURE
SENSITIVITY LEVEL
MSL1
MSL1
MSL1
MSL1
DEVICE
XWM9705EFL/V
WM9705SEFL/V
XWM9705EFL/RV
WM9705SEFL/RV
Note:
Reel quantity = 2,200
TEMP. RANGE
-25 to 85
o
C
-25 to 85
o
C
-25 to 85
o
C
-25 to 85
o
C
PACKAGE
48-pin QFN
48-pin QFN
(lead free)
48-pin QFN
(tape and reel)
48-pin QFN
(lead free, tape and reel)
MOISTURE
SENSITIVITY LEVEL
MSL3
MSL3
MSL3
MSL3
ABSOLUTE MAXIMUM RATINGS
Absolute Maximum Ratings are stress ratings only. Permanent damage to the device may be caused by continuously operating at
or beyond these limits. Device functional operating limits and guaranteed performance specifications are given under Electrical
Characteristics at the test conditions specified.
ESD Sensitive Device. This device is manufactured on a CMOS process. It is therefore generically susceptible
to damage from excessive static voltages. Proper ESD precautions must be taken during handling and storage
of this device.
Wolfson tests its package types according to IPC/JEDEC J-STD-020B for Moisture Sensitivity to determine acceptable storage
conditions prior to surface mount assembly. These levels are:
MSL1 = unlimited floor life at <30°C / 85% Relative Humidity. Not normally stored in moisture barrier bag.
MSL2 = out of bag storage for 1 year at <30°C / 60% Relative Humidity. Supplied in moisture barrier bag.
MSL3 = out of bag storage for 168 hours at <30°C / 60% Relative Humidity. Supplied in moisture barrier bag.
The Moisture Sensitivity Level for each package type is specified in Ordering Information.
Note:
The TQFP version is classified as MSL1 and does not require to be drybagged but will be supplied as such, labelled as MSL1.
CONDITION
Digital supply voltage
Analogue supply voltage
Voltage range digital inputs
Voltage range analogue inputs
Operating temperature range, T
A
Storage temperature after soldering
Package body temperature (soldering 10 seconds)
Package body temperature (soldering 2 minutes)
MIN
-0.3V
-0.3V
DVSS -0.3V
AVDD -0.3V
-25
o
C
-65
o
C
MAX
+7V
+7V
DVDD +0.3V
AVDD +0.3V
+85
o
C
+150
o
C
+240 C
+183
o
C
o
w
PD Rev 4.0 December 2003
4
WOLFSON [ WOLFSON MICROELECTRONICS PLC ]
