X2816C
PACKAGING INFORMATION
32-PAD CERAMIC LEADLESS CHIP CARRIER PACKAGE TYPE E
0.300 (7.62)
BSC
0.150 (3.81) BSC
0.020 (0.51) x 45° REF.
0.015 (0.38)
0.003 (0.08)
0.095 (2.41)
0.075 (1.91)
PIN 1
0.022 (0.56)
DIA.
0.006 (0.15)
0.055 (1.39)
0.200 (5.08)
BSC
0.045 (1.14)
TYP. (4) PLCS.
0.015 (0.38)
MIN.
0.028 (0.71)
0.040 (1.02) x 45° REF.
0.022 (0.56)
(32) PLCS.
TYP. (3) PLCS.
0.050 (1.27) BSC
0.458 (11.63)
0.088 (2.24)
0.050 (1.27)
0.442 (11.22)
0.120 (3.05)
0.458 (11.63)
––
0.060 (1.52)
0.558 (14.17)
––
0.560 (14.22)
0.540 (13.71)
0.400 (10.16)
BSC
PIN 1 INDEX CORNER
NOTE:
1. ALL DIMENSIONS IN INCHES (IN PARENTHESES IN MILLIMETERS)
2. TOLERANCE: ±1% NLT ±0.005 (0.127)
3926 FHD F14
14
XICOR [ XICOR INC. ]
