1
R
Virtex-II Platform FPGAs:
Complete Data Sheet
Product Specification
DS031 (v3.5) November 5, 2007
Module 1:
Introduction and Overview
7 pages
•
•
•
•
•
Summary of Features
General Description
Architecture
Device/Package Combinations and Maximum I/O
Ordering Examples
Module 3:
DC and Switching Characteristics
43 pages
•
•
•
•
•
•
•
Electrical Characteristics
Performance Characteristics
Switching Characteristics
Pin-to-Pin Output Parameter Guidelines
Pin-to-Pin Input Parameter Guidelines
DCM Timing Parameters
Source-Synchronous Switching Characteristics
Module 2:
Functional Description
41 pages
•
Detailed Description
-
-
-
-
-
-
-
Input/Output Blocks (IOBs)
Digitally Controlled Impedance (DCI)
Configurable Logic Blocks (CLBs)
18-Kb Block SelectRAM™ Resources
18-Bit x 18-Bit Multipliers
Global Clock Multiplexer Buffers
Digital Clock Manager (DCM)
Module 4:
Pinout Information
226 pages
•
•
Pin Definitions
Pinout Tables
-
-
-
-
-
-
-
-
-
-
CS144/CSG144 Chip-Scale BGA Package
FG256/FGG256 Fine-Pitch BGA Package
FG456/FGG456 Fine-Pitch BGA Package
FG676/FGG676 Fine-Pitch BGA Package
BG575/BGG575 Standard BGA Package
BG728/BGG728 Standard BGA Package
FF896 Flip-Chip Fine-Pitch BGA Package
FF1152 Flip-Chip Fine-Pitch BGA Package
FF1517 Flip-Chip Fine-Pitch BGA Package
BF957Flip-Chip BGA Package
•
•
•
Routing
Creating a Design
Configuration
IMPORTANT NOTE:
Page, figure, and table numbers begin at 1 for each module, and each module has its own Revision
History at the end. Use the PDF "Bookmarks" pane for easy navigation in this volume.
© 2000–2007 Xilinx, Inc. All rights reserved. XILINX, the Xilinx logo, the Brand Window, and other designated brands included herein are trademarks of Xilinx, Inc. All other
trademarks are the property of their respective owners.
DS031 (v3.5) November 5, 2007
Product Specification
1
XILINX [ XILINX, INC ]
