Phycomp
Product specification
Surface-mount ceramic
multilayer capacitors
TESTS AND REQUIREMENTS
Table 3
Test procedures and requirements
IEC
60068-2
TEST
METHOD
Class 2, X7R
10 V
IEC
60384-10/
CECC 32 100
CLAUSE
4.4
TEST
mounting
PROCEDURE
the capacitors may be mounted
on printed-circuit boards or
ceramic substrates by applying
wave soldering, reflow soldering
(including vapour phase
soldering) or conductive adhesive
any applicable method using
×10
magnification
f = 1 kHz; measuring voltage
1 Vrms at 20 °C
f = 1 kHz; measuring voltage
1 Vrms at 20 °C
at U
R
(DC) for 1 minute
2.5
×
U
R
for 1 minute;
between minimum and
maximum temperature
a force of 5 N applied for 10 s to
the line joining the terminations
and in a plane parallel to the
substrate
mounted in accordance with
CECC 32 100, paragraph 4.4
conditions: bending
1 mm at a rate of 1 mm/s,
radius jig. 340 mm
REQUIREMENTS
no visible damage
4.5
4.6.1
4.6.2
4.6.3
4.6.4
4.7.1
4.8
visual inspection and
dimension check
capacitance
tan
δ
insulation resistance
voltage proof
temperature
characteristic
adhesion
in accordance with
specification
within specified tolerance
in accordance with
specification
in accordance with
specification
no breakdown or
flashover
in accordance with
specification
no visible damage
4.9
bond strength of
plating on end face
no visible damage
∆C/C: ≤10%
4.10
Tb
resistance to
soldering heat
resistance to
leaching; jig clamps
to the second
component in the
longitudinal line
precondition:
120 to 150
°C
for 1 minute;
260
±5 °C
for 10
±0.5
s
260
±5 °C
for 30
±1
s
in a static solder bath
the terminations shall be
well tinned after recovery
∆C/C: ≤10%
using visual enlargement
of
×10,
dissolution of the
terminations shall not
exceed 10%
2005 Jan 14 Rev.9
8
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