Product specification
11
14
Surface-Mount Ceramic Multilayer Capacitors
General Purpose & High Cap.
Y5V
6.3 V to 50 V
TEST
Bond
strength of
plating on
end face
TEST METHOD
IEC 60384-
21/22
4.8
PROCEDURE
Mounting in accordance with IEC 60384-22
paragraph 4.3
Conditions: bending 1 mm at a rate of 1 mm/s,
radius jig 340 mm
REQUIREMENTS
No visible damage
<General purpose series>
∆C/C
Class2:
Y5V: ±10%
<High Capacitance series>
∆C/C
Class2:
Y5V: ±10%
Resistance to
soldering
heat
4.9
Precondition: 150 +0/–10 °C for 1 hour, then keep
for 24 ±1 hours at room temperature
Preheating: for size
≤
1206: 120 °C to 150 °C for 1
minute
Preheating: for size >1206: 100 °C to 120 °C for 1
minute and 170 °C to 200 °C for 1 minute
Solder bath temperature: 260 ±5 °C
Dipping time: 10 ±0.5 seconds
Recovery time: 24 ±2 hours
Dissolution of the end face plating shall not
exceed 25% of the length of the edge
concerned
<General purpose series>
∆C/C
Class2:
Y5V: ±20%
<High Capacitance series>
∆C/C
Class2:
Y5V: ±20%
D.F. within initial specified value
R
ins
within initial specified value
Solderability
4.10
Preheated the temperature of 80 °C to 140 °C and
maintained for 30 seconds to 60 seconds.
Test conditions for lead containing solder alloy
Temperature: 235 ±5 °C
Dipping time: 2 ±0.2 seconds
Depth of immersion: 10 mm
Alloy Composition: 60/40 Sn/Pb
Number of immersions: 1
Test conditions for leadfree containing solder alloy
Temperature: 245 ±5 °C
Dipping time: 3 ±0.3 seconds
Depth of immersion: 10 mm
Alloy Composition: SAC305
Number of immersions: 1
The solder should cover over 95% of the
critical area of each termination
www.yageo.com
Jul 29, 2010 V.5
YAGEO [ YAGEO CORPORATION ]
