Product specification
13
15
General Purpose
NP0
16 V to 50 V
Surface-Mount Ceramic Multilayer Capacitors
TEST
TEST METHOD PROCEDURE
REQUIREMENTS
IEC 60384- 4.9
21/22
Precondition: 150 +0/–10 °C for 1 hour, then keep for 24
±1 hours at room temperature
Dissolution of the end face plating shall
not exceed 25% of the length of the
edge concerned
Resistance to
soldering
heat
Preheating: for size ≤ 1206: 120 °C to 150 °C for 1 minute
Preheating: for size >1206: 100 °C to 120 °C for 1 minute
and 170 °C to 200 °C for 1 minute
<General purpose series>
∆C/C
Solder bath temperature: 260 ±5 °C
Dipping time: 10 ±0.5 seconds
Recovery time: 24 ±2 hours
Class 1:
NP0: within ±0.5% or 0.5 pF
whichever is greater
D.F. within initial specified value
Rins within initial specified value
4.10
Preheated the temperature of 80 °C to 140 °C and
maintained for 30 seconds to 60 seconds.
The solder should cover over 95% of
the critical area of each termination
Solderability
Test conditions for lead containing solder alloy
Temperature: 235 ±5 °C
Dipping time: 2 ±0.2 seconds
Depth of immersion: 10 mm
Alloy Composition: 60/40 Sn/Pb
Number of immersions: 1
Test conditions for lead-free containing solder alloy
Temperature: 245 ±5 °C
Dipping time: 3 ±0.3 seconds
Depth of immersion: 10 mm
Alloy Composition: SAC305
Number of immersions: 1
4.11
Preconditioning;
150 +0/–10 °C for 1 hour, then keep for
24 ±1 hours at room temperature
No visual damage
Rapid change
of
temperature
<General purpose series>
∆C/C
5 cycles with following detail:
30 minutes at lower category temperature
30 minutes at upper category temperature
Class 1:
NP0: within ±1% or 1 pF
whichever is greater
Recovery time 24 ±2 hours
D.F. meet initial specified value
R
ins meet initial specified value
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Aug 05, 2011 V8
YAGEO [ YAGEO CORPORATION ]
