Product specification
13
16
Surface-Mount Ceramic Multilayer Capacitors
High-Voltage
NP0
/
X7R
1 KV to 3 KV
TEST
Adhesion
TEST METHOD
IEC 60384-
21/22
4.7
PROCEDURE
A force applied for 10 seconds to the line joining
the terminations and in a plane parallel to the
substrate
REQUIREMENTS
Force
size
≥
0603: 5N
Bond
Strength of
Plating on
End Face
4.8
Mounting in accordance with IEC 60384-22
paragraph 4.3
Conditions: bending 1 mm at a rate of 1 mm/s,
radius jig 340 mm
No visible damage
∆C/C
Class 1:
NP0: within ±1% or 0.5 pF, whichever is greater
Class2:
X7R: ±10%
Resistance to
Soldering
Heat
4.9
Precondition: 150 +0/–10 °C for 1 hour, then
keep for 24 ±1 hours at room temperature
Preheating: for size
≤
1206: 120 °C to 150 °C for
1 minute
Preheating: for size >1206: 100 °C to 120 °C for
1 minute and 170 °C to 200 °C for 1 minute
Solder bath temperature: 260 ±5 °C
Dipping time: 10 ±0.5 seconds
Recovery time: 24 ±2 hours
Dissolution of the end face plating shall not
exceed 25% of the length of the edge
concerned
∆C/C
Class 1:
NP0: within ±0.5% or 0.5 pF, whichever is greater
Class2:
X7R: ±10%
D.F. within initial specified value
R
ins
within initial specified value
Solderability
4.10
Preheated to a temperature of 80 °C to 140 °C
and maintained for 30 seconds to 60 seconds.
Test conditions for lead containing solder alloy
Temperature: 235 ±5 °C
Dipping time: 2 ±0.2 seconds
Depth of immersion: 10 mm
Alloy Composition: 60/40 Sn/Pb
Number of immersions: 1
Test conditions for lead-free containing
solder alloy
Temperature: 245 ±5 °C
Dipping time: 3 ±0.3 seconds
Depth of immersion: 10 mm
Alloy Composition: SAC305
Number of immersions: 1
The solder should cover over 95% of the critical
area of each termination
www.yageo.com
Aug 08, 2011 V.4
YAGEO [ YAGEO CORPORATION ]
