YAS529
Package Outline Drawing
Caution
* The product of the WLCSP package should be used under light-shielded conditions.
Since the WLCSP package has a structure that a silicon wafer is exposed, if light (such as sunlight) hits the
wafer, the device may malfunction (leak current increase etc.) due to electric charge internally generated by the
photoelectric effect.
* Please mount the package without underfill because temperature correction may not be normally performed
when mounting YAS529 on a board.
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YAMAHA [ YAMAHA CORPORATION ]
