IC176 Series
Specifications
Single Inline Memory Module
(SIMM)
Part Number
(Details)
Insulation Resistance:
1,000M
W
min. at 500V DC
Dielectric Withstanding Voltage: 700V AC for 1 minute
Contact Resistance:
30m
W
max. at 10mA/20mV max.
Current Rating:
1A max.
Operating Temperature Range: –40°C to +150°C
Mating Cycles:
10,000 insertions min.
IC-176
-
4
-
MF
Series No.
Design Number
MF = Flanged
Unmarked = Not Flanged
Materials and Finish
Housing: Polyethersulphone (PES), Polyetherimide (PEI)
Contacts: Beryllium Copper (BeCu)
Plating: Gold over Nickel
Features
í
Card thickness 1.27mm
í
Kelvin type contact which utiIizes both sides of the contact system
í
Easy insertion and extraction by latch
Outline Socket Dimensions
IC-176-2-**
Recommended PC Board Layout
Top View from Socket
134.0
1.27 x 35 = 44.45
1.27
6.35
1.27 x 35 = 44.45
A
8.28
5.08
B
144-
Æ
0.8
2-
Æ
3.2
C
Matching IC Dimensions
Pitch
1.8 min
107.95
101.19
Æ3.18
9.14
1.27
12.95 min
R- 1.57
10.16
6.35
Component area
2.03
1.27
44.45
6.35
1.04
44.45
Part Number
IC-176-4-**
IC-176-6-**
IC-176-8-**
IC-176-2-**
IC-176-10-**
Pin Count
30
35
64
72
100
Pitch
2.54
2.54
1.27
1.27
1.27
A
100.0
115.0
115.0
125.0
161.4
B
9.0
9.0
15.0
15.0
17.0
C
30.0
30.0
30.0
30.0
30.0
Test & Burn-In
SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE – DIMENSIONS IN MILLIMETER
3.17 min
2.79
YAMAICHI [ YAMAICHI ELECTRONICS CO., LTD. ]
