NP89 Series
Specifications
Pin Grid Array / Zero Insertion Force
(PGA / ZIF)
Part Number
(Details)
1,000M
W
min. at 500V DC
Insulation Resistance:
Dielectric Withstanding Voltage:700V AC for 1 minute
30m
W
max. at 10mA/20mV max.
Contact Resistance:
Operating Temperature Range: –40°C to +170°C
NP89
Series No.
-
121 10 MF
-
G 4
-
BF
No. of Contact Pins
Materials and Finish
Housing: Polyetherimide (PEI), glass-filled, UL94V-0
Contacts: Beryllium Copper (BeCu)
Plating: Gold over Nickel
Design Number
MF =Flanged
Unmarked = Not Flanged
Contact Plating (Gold)
Features
í
Wiping action system: Cleans up IC lead surface during
handling action
í
Reliable 3 point contact system
í
Cost performance: Different contact thickness for contact area
and terminal area
í
Depopulated versions available
í
Also available with lever on the right hand side, standard type
is lever on the left hand side
Contact Terminal Style
Plating Specification
Standard lever left side
Outline Socket Dimensions
Recommended PC Board Layout
Top View from Socket
A
C
B
2.54
9.5
9.0
2-
Æ
3.2
Æ0.8
2.54
7.5
7.5
D
2-
Æ
3.2
B
G
0.55
B
F
E
Part Number
NP89-12110**-G4-BF
NP89-14409**-G4-BF
NP89-13302**-G4-BF
NP89-19601**-G4-BF
NP89-22508**-G4-BF
NP89-21004**-G4-BF
NP89-28906**-G4-BF
NP89-36105**-G4-BF
NP89-44111**-G4-BF
NP89-62522**-G4-BF
Grid
Size
11 x 11
12 x 12
14 x 14
14 x 14
15 x 15
17 x 17
17 x 17
19 x 19
21 x 21
25 x 25
Pin
Count
121
144
133
196
225
210
289
361
441
625
A
42.5
43.1
51.0
51.0
52.7
59.0
59.0
63.7
69.0
85.7
Socket and PC Board Dimensions
E
F
D
B
C
25.4
27.94
32.02
32.02
35.56
40.64
40.64
45.72
50.8
60.96
14.0
12.0
14.65
14.65
14.0
14.65
14.65
14.65
14.95
17.95
42.5
42.7
51.0
49.0
50.3
57.0
57.0
61.7
68.0
82.0
52.0
52.6
60.5
60.5
65.4
71.7
71.7
73.2
81.7
95.2
50.1
50.7
58.6
58.6
60.3
66.6
66.6
71.3
76.4
92.8
G
17.55
15.55
18.2
18.2
17.55
18.2
18.2
18.2
18.5
21.5
Test & Burn-In
SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE – DIMENSIONS IN MILLIMETER
YAMAICHI [ YAMAICHI ELECTRONICS CO., LTD. ]
