DATA SHEET
SEMICONDUCTOR
SOD-123 Plastic-Encapsulate Diode
ZENER DIODE
BZT52C2V4-BZT52C51
SOD123
Unit:inch(mm)
FEATURES
•Planar
Die Construction
•500mW
Power Dissipation on Ceramic PCB
•General
Purpose Medium Current
•Ideally
Suited for Automated Assembly
Processes
•
High temperature soldering : 260
O
C / 10 seconds at terminals
•
Pb free product at available : 99% Sn above meet RoHS
environment substance directive request
Symbol
A
A1
A2
b
c
D
E
E1
L
L1
θ
Dimensions In Millimeters
Min
Max
1.050
1.250
0.000
0.100
1.050
1.150
0.450
0.650
0.080
0.150
1.500
1.700
2.600
2.800
3.550
3.850
0.500 REF
0.250
0.450
0°
8°
Dimensions In Inches
Min
Max
0.041
0.049
0.000
0.004
0.041
0.045
0.018
0.026
0.003
0.006
0.059
0.067
0.102
0.110
0.140
0.152
0.020 REF
0.010
0.018
0°
8°
Maximum Ratings (Tamb=25℃ unless otherwise specified)
Characteristic
Forward Voltage
@ IF = 10mA
Power Dissipation (Note 1)
Thermal Resistance, Junction to Ambient Air (Note 1)
Operating and Storage Temperature Range
Symbol
VF
Pd
RθJA
Tj, TSTG
Value
0.9
500
305
-55 to +150
Unit
V
mW
℃/W
℃
http://www.yeashin.com
1
REV.02 20120403