DEVICE CHARACTERISTICS
BZX55C Series
0.7
HEAT
SINKS
θ
JL, JUNCTION TO LEAD THERMAL RESISTANCE (
°
C/W)
500
0.6
P D , MAXIMUM STEADY STATE
POWER DISSIPATION (WATTS)
400
0.5
L
300
L
0.4
3/8"
3/8"
0.3
2.4-60 V
200
0.2
62-200 V
100
0.1
0
0
20
40
60
80
100
120
140
160
180
200
T L , LEAD TEMPERATURE (°C)
0
0
0.2
0.4
0.6
0.8
1
L , LEAD LENGTH TO HEAT SINK (INCH)
Figure 1. Steady State Power Derating
Figure 2. Typical Thermal Resistance
1000
7000
5000
2000
1000
700
500
200
100
70
50
I R , LEAKAGE CURRENT (
µ
A)
20
10
7
5
2
1
0.7
0.5
TYPICAL LEAKAGE CURRENT
AT 80% OF NOMINAL
BREAKDOWN VOLTAGE
+125°C
0.2
0.1
0.07
0.05
0.02
0.01
0.007
0.005
0.002
0.001
3
4
5
6
7
8
9
10
11
12
13
VZ , NOMINAL ZENER VOLTAGE (VOLTS)
14
15
+25°C
Figure 3. Typical Leakage Current
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