DATA SHEET
SEMICONDUCTOR
KBPC25005N THRU KBPC2510N
BR35N Unit: inch(mm)
VOLTAGE RANGE 50 to 1000 Volts
CURRENT 25 Ampere
FEATURES
•Low
cost
•This
series is UL recognized under component
index, file number E127707
•High
forward surge current capability
•Integrally
molded heatsink provide
very low thermal resistance.
•High
isolation voltage from case to lugs.
•High
temperature soldering guaranteed:
260℃/10 second, at 5 lbs. (2.3kg) tension.
•High
temperature soldering : 260
O
C / 10 seconds at terminals
•Pb
free product at available : 99% Sn above meet RoHS
environment substance directive request
MECHANICAL DATA
•Case:
Molded plastic body, suffic "N" for thinner type
•Terminal:
Plated 0.25" (6.35mm) lug.
•Polarity:
Polarity symbols marked on case.
•Mounting:
Thru hole for #10 screw, 20 in,- lbs. Torqute Max.
•Weight:
0.55 ounce, 15.6gram(KBPC25N)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
•Ratings
at 25℃ ambient temperature unless otherwise specified
•Single
phase, half wave, 60Hz, resistive or inductive load.
•For
capacitive load derate current by 20%
SYMBOLS
Maximum Repetitive Peak Reverse Voltage
Maximum RMS Voltage
Maximum DC Blocking Voltage
Maximum Average Forward Rectified Output
Current, at TC = 50_ (Note 1, 2)
Peak Forward Surge Current
8.3ms single half sine - wave superimposed on
rated load (JEDEC method )
Rating for Fusing (t<8.3ms)
Maximum Instantaneous Forward Voltage Drop
per bridge element at 12.5A
Maximum DC Reverse Current at rate
DC blocking voltage per element
Isolation Voltage from case to lugs
Typical Thermal Resistance (Note 1,2)
Operating Temperature Range
Storage Temperature Range
TA = 25℃
IR
TA =100℃
VISO
RθJC
TJ
TSTG
1.0
2500
2.0
(-65 to +150)
(-65 to +150)
mA
VAC
℃/W
℃
I2t
VF
373
1.1
10
A2s
Volts
μA
IFSM
300
Amps
VRRM
VRMS
VDC
I(AV)
KBPC
KBPC
KBPC
2502N
200
140
200
KBPC
2504N
400
280
400
25
KBPC
2506N
600
420
600
KBPC
2508N
800
560
800
KBPC
2510N
1000
700
1000
UNIT
Volts
Volts
Volts
Amps
25005N 2501N
50
35
50
100
70
100
1. Unit mounted on 5" X 6" X 4.9" (12.8cm X 15.2cm X 12.4cm)Al. finned Plate.
2. Bolt down on heat-sink with silicon thermal compound between bridge and mounting sutfae for maximum heat
transfer efficiency with # 10 screw.
http://www.yeashin.com
1
REV.02 20120305
YEASHIN [ Yea Shin Technology Co., Ltd ]
