ZXTCM322
ABSOLUTE MAXIMUM RATINGS.
PARAMETER
SYMBOL
LIMIT
100
50
UNIT
V
Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
Peak Pulse Current (c)
Continuous Collector Current (a)
Base Current
V
V
V
CBO
CEO
EBO
V
7.5
6
V
I
I
I
A
CM
4
A
C
B
1000
mA
Power Dissipation at TA=25°C (a)
Linear Derating Factor
P
P
P
P
1.5
12
W
D
D
D
D
mW/°C
Power Dissipation at TA=25°C (b)
Linear Derating Factor
2.45
19.6
W
mW/°C
Power Dissipation at TA=25°C (d)
Linear Derating Factor
1
8
W
mW/°C
Power Dissipation at TA=25°C (e)
Linear Derating Factor
3
24
W
mW/°C
Operating and Storage Temperature Range
T :T
-55 to +150
°C
j
stg
THERMAL RESISTANCE
PARAMETER
SYMBOL
VALUE
83
UNIT
°C/W
°C/W
°C/W
°C/W
Junction to Ambient (a)
Junction to Ambient (b)
Junction to Ambient (d)
Junction to Ambient (e)
NOTES
R
R
R
R
θJA
θJA
θJA
θJA
51
125
42
(a) For a single device surface mounted on 10sq cm1oz copper on FR4 PCB in still air conditions with all exposed pads attached.
(b) For a single device surface mounted on 10sq cm1oz copper on FR4 PCB in still air conditions measured at tр5 secs with all exposed pads
attached.
(c) Repetitive rating - pulse width limited by max junction temperature. refer to Transient Thermal Impedance graph.
(d) For a single device surface mounted on 10sq cm1oz copper on FR4 PCB in still air conditions with minimal lead connections only.
(e) For a single device surface mounted on 65sq cm2oz copper on FR4 PCB in still air conditions with all exposed pads attached.
(f) The minimum copper dimensions requires for mounting are no smaller than the exposed metal pads on the base of the device, as shown in
the package dimensions data. The thermal resistance for a device mounted on 1.5mm thick FR4 board using minimum copper of 1oz weight and
1mm wide wide tracks is Rth=300ЊC giving a power rating of Ptot=420mW.
ISSUE 2 - JUNE 2002
2
ZETEX [ ZETEX SEMICONDUCTORS ]
