ZMD-Standard
August 2001
Package PQFP44
(10 x 10)
MDS
716
Supersedes
Edition 11.95
Dimensions in millimetres
Based on JEDEC: MS-112AA-1
1 Dimensions
Z
A
2
A
0,1
Detail Z
0,2
M
b
p
H
E
E
L
P
A
1
b
1
D
H
D
Dimensions of Sub-Group B1
e
nom
A
max
b
Pmin
b
Pmax
H
Emin
H
Emax
H
Dmin
H
Dmax
L
Pmin
2 Weight
3 Package Body Material
4 Lead Material
5 Lead Finish
6 Lead Form
£
0,6 g
Low Stress Epoxy
FeNi-Alloy or Cu-Alloy
solder plating
Z-bends
0,80
2,60
0,25
0,45
13,65
14,30
13,65
14,30
0,63
Dimensions of Sub-Group C1
A
min
A
1min
A
1max
A
2min
A
2max
c
min
c
max
D
min
*
D
max
*
E
min
*
E
max
*
q
min
q
max
b
2,10
0,15
0,50
1,80
2,20
0,11
0,23
9,90
10,10
9,90
10,10
0°
10°
45°
* without mold flash
Editor:
Check:
Date:
Quality:
e
Doc-No.
QS-000716-HD-03
Proprietary data, company confidential. All rights reserved.
Als Betriebsgeheimnis anvertraut. Alle Rechte vorbehalten.
c
G
ZMD [ Zentrum Mikroelektronik Dresden AG ]
