ZMD-Standard
November 1995
Package SOP20
(300 mil)
MDS
727
Supersedes
Edition 01.95
Dimensions in millimetres
Based on IEC 191-2Q: Type 075E04 B
1 Dimensions
X
A
2
A
View X
k x 45
°
0,1
20
A
1
1
Z
e
D
b
0,2
M
Dimensions of Sub-Group B1
A
max
b
Pmin
b
Pmax
e
nom
H
Emin
H
Emax
L
Pmin
Z
max
2,65
0,35
0,49
1,27
10,00
10,65
0,40
0,81
H
E
E
Dimensions of Sub-Group C1
A
min
A
1min
A
1max
A
2min
A
2max
c
min
c
max
D
min
*
D
max
*
2,35
0,10
0,30
2,25
2,45
0,23
0,32
12,60
13,00
7,40
7,60
0,25
0°
8°
* without mold-flash
2 Weight
3 Package Body Material
4 Lead Material
5 Lead Finish
6 Lead Form
£
0,55 g
Low Stress Epoxy
E
min
*
E
max
*
k
min
q
min
q
max
FeNi-Alloy or Cu-Alloy
solder plating
Z-bends
Zentrum Mikroelektronik Dresden GmbH
Editor: signed Schoder
Check signed Wlde:
Date: 13.11.1995
Quality: signed Lorenz
Doc-No.
QS-000727-HD-02
Als Betriebsgeheimnis anvertraut. Alle Rechte vorbehalten.
Proprietary data, company confidential. All rights reserved.
c
L
P
G
ZMD [ Zentrum Mikroelektronik Dresden AG ]
