ZMD-Standard
April 2002
Package PQ4-LQFP44
(10 x 10)
MDS
750
Supersedes
Edition 11.97
Dimensions in millimetres
Based on JEDEC: MS-026
Detail Z
1 Dimensions
Z
A
2
A
0,1
L
P
A
1
top view
b
0,2
M
bottom view
e
H
E
E
1
D
H
D
Dimensions of Sub-Group B1
e
nom
A
max
b
Pmin
b
Pmax
H
Emin
H
Emax
H
Dmin
H
Dmax
L
Pmin
2 Weight
3 Package Body Material
4 Lead Material
5 Lead Finish
6 Lead Form
£
0,5 g
Low Stress Epoxy
FeNi-Alloy or Cu-Alloy
solder plating
Z-bends
0,80
1,60
0,30
0,45
11,85
12,15
11,85
12,15
0,45
Dimensions of Sub-Group C1
A
min
A
1min
A
1max
A
2min
A
2max
c
min
c
max
D
min
D
max
E
min
E
max
q
min
q
max
-
0,05
0,15
1,35
1,45
0,09
0,20
9,75
10,25
9,75
10,25
0°
7°
Zentrum Mikroelektronik Dresden AG
Editor: signed Schoder
Check: signed Marx
Date: 30.04.2002
Quality: signed Gersdorf
Doc-No.
QS-000750-HD-02
c
Heat sink
G
ZMD [ Zentrum Mikroelektronik Dresden AG ]
