ZMD-Standard
December 2004
Package TSOP32 (I/8x20)
(Normal Option)
MDS
751
Dimensions in millimetres
Based on JEDEC: JEP95 MO-142
1 Dimensions
Z
A
2
Detail
Z
0,1
32
1
A
A
1
0,1
M
e
D
H
D
Dimensions of Sub-Group B1
A
max
b
Pmin
b
Pmax
e
nom
H
Dmin
H
Dmax
L
Pmin
1,20
0,17
0,27
0,50
19,80
20,20
0,40
b
p
Dimensions of Sub-Group C1
A
min
A
1min
A
1max
A
2min
A
2max
c
min
c
max
D
min*
-
0,05
0,15
0,90
1,05
0,10
0,21
18,30
18,50
7,80
8,20
0°
5°
2 Weight
3 Package Body Material
4 Lead Material
5 Lead Finish
6 Lead Form
≤
0,3 g
Low Stress Epoxy
FeNi-Alloy or Cu-Alloy
solder plating
Z-bends
D
max
*
E
min*
E
max
*
θ
min
θ
max
* without mold-flash
Zentrum Mikroelektronik Dresden
Editor: signature by Schoder
Check: signature by Marx
Date: 07.12.2004
Quality: signature by Tina Kochan
Doc-No.
QS-000751-HD-02
E
c
L
P
θ
ZMD [ Zentrum Mikroelektronik Dresden AG ]
