ZMD-Standard
June 2004
Package SSOP44
(300 mil)
MDS
771
Dimensions in millimetres
1 Dimensions
View X
A
A
2
X
k x 45°
0,1
44
A
1
E
1
Z
e
D
b
p
0,2
M
Dimensions of Sub-Group B1
A
max
b
Pmin
b
Pmax
e
nom
H
Emin
H
Emax
L
Pmin
Z
max
2,64
0,28
0,51
0,8
10,11
10,51
0,4
0,51
H
E
Dimensions of Sub-Group C1
A
min
A
1min
A
1max
A
2min
A
2max
c
min
c
max
D
min
*
D
max
*
2,44
0,1
0,3
2,14
2,54
0,23
0,32
17,73
17,93
7,40
7,60
0,5
0°
8°
* without mold-flash
2 Weight
3 Package Body Material
4 Lead Material
5 Lead Finish
6 Lead Form
≤
0,8 g
Low Stress Epoxy
Cu-Alloy
solder plating
Z-bends
E
min
*
E
max
*
k
min
θ
min
θ
max
Zentrum Mikroelektronik Dresden
Editor: signed Schoder
Check: signed Marx
Date: 4. June 2004
Quality: signed Tina Kochan
Doc-No.
QS-000771-HD-01
c
L
P
θ
ZMD [ Zentrum Mikroelektronik Dresden AG ]
